摘要
本文针对目前常用的超声波测厚的无损检测方法,对影响测厚结果的压电晶片、背衬材料性能等进行了定量研究。系统研究了压电晶片性能及影响因素,确定合适的压电晶片材料及尺寸,对测厚探头进行优化。分别研究了背衬材料的尺寸、钨粉粒径和声阻抗率对探头的分辨率和灵敏度的影响,选择最适于测厚使用的阻尼块。对优化设计的探头进行了测试,达到较高的灵敏度和分辨率。
In this paper, the properties of piezoelectric wafers and backing materials which influence the thickness measurement results are studied quantitatively, aiming at the nondestructive testing methods commonly used at present. The performances and influencing factors of piezoelectric wafer are systematically studied. The suitable material and size of piezoelectric wafer are determined, and the thickness measuring probe is optimized. The effects of backing material size, tungsten powder size and acoustic impedance on the resolution and sensitivity of the probe are studied respectively, and the most suitable damper for thickness measurement is selected. The optimized probe has been tested to achieve high sensitivity and resolution.
作者
马凯丽
滕阳阳
张峥
Ma Kaili;Teng Yangyang;Zhang Zheng(School of Materials Science and Engineering,Beihang University,Beijing 100191,China)
出处
《金属热处理》
CAS
CSCD
北大核心
2019年第S01期680-683,共4页
Heat Treatment of Metals
基金
国家重点研发计划项目(2016YFC081903).
关键词
超声测厚
压电晶片
背衬材料
ultrasonic thickness measurement
piezoelectric wafers
the backing material
作者简介
马凯丽(1997-),北京航空航天大学硕士研究生,E-mail:ariycayce@163.com
