摘要
散热已经成为空调主板设计的瓶颈问题,散热不合理造成主板烧损的现象时有发生。目前散热器设计多以经验加实测验证为主,对散热器的关键影响参数认识不足,设计时具有一定的盲目性。以某款变频空调为研究对象,采用Ansys-Icepak建立散热仿真方法,通过实测进行验证,并对散热器基板厚度、翅片高度、翅片间距等关键参数对散热效果的影响进行深入研究。结果表明:该仿真分析方法与实测趋势一致,可以指导设计,提高设计效率。翅片间距、基板厚度均不能过大和过小,由于成本、空间限制,翅片长度不能过长,当翅片间距4~6mm、基板厚度5~7mm、翅片长度50~70mm时,为最优散热器。
Heat dissipation has become a bottleneck problem in the design of air conditioning motherboards and unreasonable heat dissipation causes the motherboard to burn out.At present,the design of the radiator is mainly based on experience and actual measurement,the key influence parameters of the radiator are insufficiently understood,and the design is blind.Takes an inverter air conditioner as the research object,and uses Ansys-Icepak to establish the heat dissipation simulation method.Through the actual measurement,the influence of the heat sink substrate thickness,fin height,fin spacing and other key parameters on the heat dissipation effect is deeply studied.The results show that the simulation analysis method is consistent with the measured trend,which can guide the design and improve the design efficiency.Fin spacing and substrate thickness should not be too large or too small,due to cost and space constraints,the fin length cannot be too long.When the fin pitch is 4~6 mm,the substrate thickness is 5~7 mm,and the fin length is 50~70 mm,it is an optimal heat sink.
作者
张园
马海林
赖孝成
江世恒
ZHANG Yuan;MA Hailin;LAI Xiaocheng;JIANG Shiheng(Zhuhai Gree Electrical Appliance Co.,Ltd.Zhuhai 519070)
出处
《家电科技》
2020年第1期50-52,72,共4页
Journal of Appliance Science & Technology
