摘要
Sn-Cu-Ni系无铅钎料价格低廉,综合性能好,成为替代传统Sn-Pb钎料的理想选择之一。本文系统介绍了Sn-Cu-Ni系无铅钎料的发展历程,综述了不同合金元素以及加工工艺对其微观组织、物理性能、润湿性能、界面反应、力学性能产生的影响,最后总结了Sn-Cu-Ni系无铅钎料的特点和优势,并针对新型Sn-Cu-Ni系无铅钎料的未来发展趋势以及发展前景进行了合理展望。
The price of Sn-Cu-Ni lead-free solder is low and its comprehensive properties are good, which makes it be an ideal alternative to replace traditional Sn-Pb solders. The development of Sn-Cu-Ni lead-free solders was introduced systematically. The effects of different alloying elements and processing processes on their microstructure, physical properties,wettability, interfacial reaction and mechanical properties were summarized. Finally, the characteristics and advantages of Sn-Cu-Ni lead-free solders were summarized, and the future development trend and development prospect of new type Sn-Cu-Ni system lead-free solders were prospected.
作者
樊江磊
翟恒涛
刘占云
刘建秀
FAN Jianglei;ZHAI Hengtao;LIU Zhanyun;LIU Jianxiu(Henan Engineering Research Center of Advanced Materials Processing and Testing,Zhengzhou University of Light Industry,Zhengzhou 450002,China;Zhengzhou Key Laboratory of Advanced Materials Forming and Testing Technology,Zhengzhou University of Light Industry,Zhengzhou 450002,China;Institute of Mechanical and Electrical Engineering,Zhengzhou University of Light Industry,Zhengzhou 450002,China)
出处
《热加工工艺》
北大核心
2020年第5期1-6,共6页
Hot Working Technology
基金
国家自然科学基金项目(51501167)
河南省科技开放合作项目(162106000019).
作者简介
樊江磊(1983-),男,河南南阳人,副教授,博士,主要研究方向:金属材料成形与凝固技术,电话:13838319825,E-mail:JLFan2011@163.com
