摘要
采用双辊铸轧制备了Cu-3.2Ni-0.75Si合金,研究了固溶温度对合金显微组织、电导率、显微硬度和元素偏析行为的影响。结果表明,随着固溶温度升高,合金显微组织逐渐发生回复、再结晶和再结晶晶粒长大;合金的显微硬度随固溶温度的升高而下降,电导率随固溶温度的升高先降低后升高。经900℃×1 h固溶后,Ni、Si元素已完全固溶进铜基体,形成α-Cu固溶体,此时合金的显微硬度(HV)和电导率分别为67.2和9.338 MS/m。
Cu-3.2 Ni-0.75 Si alloy was prepared by twin-roll strip casting(TRSC).The effects of solution temperature on microstructure,electrical conductivity,microhardness and element segregation behavior of the alloy were investigated.The results indicate that the microstructure of the alloy is gradually recovered,recrystallized,and recrystallized grains grow up with the increase of solution temperature.As the solution temperature increases,the microhardness is decreased and electrical conductivity is firstly decreased and then increased.After solution at 900℃for 1 h,Ni and Si are completely dissolved into Cu matrix,forming a singleα-Cu solid solution,where the microhardness and electrical conductivity of the alloy are 67.2 HV and 9.338 MS/m,respectively.
作者
贾飞
赵丹
田希晨
周吉发
樊志斌
李小亮
曲扬
宁少晨
Jia Fei;Zhao Dan;Tian Xichen;Zhou Jifa;Fan Zhibin;Li Xiaoliang;Qu Yang;Ning Shaochen(China Innovation Acadenly of Intelligent Equipment(Ningbo)Co.,Ltd.)
出处
《特种铸造及有色合金》
CAS
北大核心
2022年第4期500-504,共5页
Special Casting & Nonferrous Alloys
基金
河南省重大关键技术揭榜攻关项目(191110111000)
宁波市“3315”人才计划2020年创新团队C类
作者简介
第一作者:贾飞,男,1992年出生,硕士研究生,浙江宁波(315700),E-mail:18804017112@163.com
