摘要
随着5G通信技术的逐步商用,通信类电子产品进入发展的快节奏,通信类PCB(含服务器、交换机、存储器等)随着高速信号的不断提升,其信号完整性成为了PCB制造商的最大挑战,高速材料的应用无法避免且等级越来越高,VIP(Via in Pad)以及背钻孔设计成为主流并需要树脂进行填塞。集成密度的提升迫使PCB孔间距及孔径不断减小,厚径比不断提升;树脂塞孔工艺在高速材料等级不断提升以及厚径比AR越来越高背景下,树脂塞孔的孔内树脂裂纹成为行业痛点与共性问题,文章从塞孔树脂材料、塞孔固化工艺、通孔厚径比设计等方面,对树脂塞孔孔内裂纹形成机理进行分析研究,同时对于改善背钻孔与高厚径比通孔裂纹提出解决方案。
With the gradual commercialization of 5G,communication electronic products enter the fast pace of development.With the continuous improvement of high-speed signal,signal integrity has become the biggest challenge for PCB manufacturers.The application of high-speed materials is inevitable and the level is getting higher and higher.VIP(Via in Pad)and back drill design become the mainstream and need resin to fill.With the improvement of integrated density,PCB BGA pitch and hole diameter are constantly reduced,and the AR Aspect ratio is constantly improved.Under the background of the continuous improvement of high-speed material grade and higher aspect ratio(AR),the resin crack has become a pain point and common problem in PCB industry.This paper analyzes the resin crack in the resin plug hole from the aspects of plug hole resin material,plug hole process,aspect ratio design of through hole,etc.The mechanism of crack formation is analyzed,and the solutions to improve the back hole and high thickness diameter ratio through hole cracks are proposed.
作者
崔正丹
胡军辉
Cui Zhengdan;Hu Junhui
出处
《印制电路信息》
2021年第S01期301-308,共8页
Printed Circuit Information
关键词
树脂塞孔
树脂裂纹
机理
高厚径比
Resin Filling
Resin Crack
Mechanism
High Aspect Ratio
作者简介
第一作者:崔正丹,硕士研究生,2009年开始从事PCB相关技术工作,负责PCB(IC载板)制造技术及新产品开发,现百柔担任研发总监负责树脂材料油墨产品开发与应用。
