摘要
随着电源通讯技术的快速发展,140~350μm及其以上超厚铜箔电路板逐渐成为一类具有广阔市场前景的特殊PCB。而针对我司电源类印制电路板在电镀、线路、阻焊生产过程中,因铜厚高达315μm以上,板厚也有5.4 mm。这就导致在电镀时,有镀铜不均、镀铜堵孔等异常;制作线路时,因铜厚过高有蚀刻不净、毛边过大等异常;阻焊印刷时,因铜厚过高、线路毛边过大导致油墨气泡、undercut过大等异常,且客户终端无法锁定到PCB的周期、料号等信息。PCB一旦出现品质异常,无法有效、准确锁定影响范围,造成大批量产品隔离。为改善电源类印制电路板在压合、电镀、线路、阻焊生产过程中存在的滑板、镀铜不均、镀铜堵孔、蚀刻不净、毛边过大、油墨气泡、undercut过大等信赖度及外观异常,提升生产效率及产品良率,文章通过采用流程优化、工艺参数调整、新增一种镀铜加厚工艺流程、新增热熔块工程设计、新增阻焊追溯二维码,得出一种改善镀铜不均、蚀刻不净、undercut过大、产品追溯困难的制作工艺,可以有效解决以上问题,提升生产制程能力,减少品质风险。(注:undercut为油墨侧蚀)
With the rapid development of power communication technology,ultra-thick copper foil circuit boards of 140-350μm and above have gradually become a kind of special PCB with broad market prospects.For the power supply printed circuit board,it is special in the electroplating,circuit,welding resistance production process,because of the copper thickness up to 315μm or more and the thickness of the plate is also 5.4 mm which leads to uneven copper plating,copper plugging and other anomalies in electroplating.When making the circuit,because the copper thickness is too high,there are non-clean etching,burr too large and other anomalies.During solder resistance printing,ink bubbles and undercut are too large due to excessive copper thickness and too large line burr edge.The client terminal cannot lock the PCB cycle,part number and other information.Once the quality of PCB is abnormal,it cannot effectively and accurately lock the scope of influence,resulting in isolation of large quantities of products.In order to improve the reliability and appearance abnormality of the power supply printed circuit board such as the slide plate,copper plating uneven,copper plating hole blocking,unclean etching,excessive burr edge,ink bubble and undercut,etc.,in the production process of pressing,electroplating,circuit and solder resistance,and to improve the production efficiency and product yield,the process optimization,process parameter adjustment are made through the use of new a copper plating thickening technological process,the new hot melt piece of engineering design,the new resistance welding trace code etc.It is concluded that it can improve uneven copper plating,not clear etching,too large undercut,and difficult product traceability of production process.It can also effectively solve the above problem,improve production process capability,reduce the quality risk.
作者
王康兵
曾祥福
Wang Kangbing;Zeng Xiangfu
出处
《印制电路信息》
2021年第S02期228-234,共7页
Printed Circuit Information
关键词
镀铜
蚀刻
阻焊
追溯
油墨测蚀
Copper Plating
Etching Welding
Resistance Tracing
Undercut
作者简介
第一作者:王康兵,本科学历,4年从事PCB研发工作经验,现就职广东科翔电子科技股份有限公司任研发工程师。
