摘要
PCB的深层次、大孔径盲孔加工一直存在孔底和孔口的直径比小、孔径误差大、孔壁质量差等问题。文章论述了CO_(2)激光加工盲孔的常用方法,结合样品特征最终选择了机械控深钻加激光钻的方法,在此基础上对激光钻孔关键参数脉冲宽度、脉冲次数,焦深、光圈大小等因素进行实验研究,总结了其对盲孔孔型的影响,并通过专业的数据分析软件对实验数据进行分析,预测了合适的加工参数,选用软件预测的加工参数完成了样品的制作,最终通过品质验证,为深层次盲孔的加工提供了参考。
The deep-level,large-diameter blind hole processing of PCB has always problems such as small diameter ratio between hole bottom and orifice,large hole diameter error,and poor hole wall quality.This paper discusses the common methods of CO_(2) laser processing blind holes,and finally chooses the method of mechanically controlled deep drilling plus laser drilling in combination with the characteristics of the sample.The factors are experimentally studied,and their influence on the blind hole pattern is summarized,and the experimental data is analyzed through professional data analysis software,and the appropriate processing parameters are predicted.The processing parameters predicted by the software are used to complete the sample production.Quality verification provides a reference for the processing of deep blind holes.
作者
任文波
钟根带
何栋
Ren Wenbo;Zhong Gendai;He Dong
出处
《印制电路信息》
2022年第S01期357-365,共9页
Printed Circuit Information
关键词
深层盲孔
激光钻孔
机械控深钻
Deep Blind Holes
Laser Drilling
Deep Controled Drilling
作者简介
第一作者:任文波,毕业于沈阳航空航天大学,任职广州广合科技股份有限公司,主要从事机械加工方面的工艺研究工作。
