摘要
随着5G通信的快速发展,传输信号频率提高,电子产品装配对挠性线路的体积要求逐渐严格,对挠性线路弯曲性能的要求也不断提高。多层挠性电路在挠曲过程中发生弹性塑性变形,从而造成阻抗变化。为探究挠性电路弯曲产生的阻抗变化因素及评价方式,文章采用有限元方法对多层挠性线路进行建模及多物理场耦合计算。力学方面,利用限制位移的方式探究了不同弯曲半径及铜厚条件下弯曲模型的应力分布、塑性形变分布。信号传输方面,采用时域反射法对力学部分计算的结果进行阻抗模拟。模拟结果表明,对于100μm铜线宽的五层挠性线路,在线厚小于150μm的情况下阻抗变化值低于1%。该模型为挠性电路的弯曲变形表现及阻抗变化提供了一种评价方式和制造指标控制参考。
With the rapid development of 5G communication technology and the increment of signal frequency,the volume of flexible circuits is required to be decreased and the bending performance of circuits is also expected to be improved.The elastic-plastic deformation from the bending of multi-layer flexible circuits leads to the change of impedance.To explore the interfering factors of the undulate impedance and present evaluation targets,a numerical model for simulating the multilayer flexible circuits based on finite element method along with multi-physics coupling was developed.For the mechanics part,different bending radius and thickness of copper layers were applied using restricting displacement for estimating the stress distribution and plastic deformation.For the signal transmission part,time domain reflectometry was used to compute impedance of the bended circuits.The results showed that as the copper thickness was under 150μm,the change rate of impedance in 100μm wide circuits was under 1%.This model offers a way to estimate the bending performance and impedance change of flexible circuits,which further gives some referential targets for fabrication process control.
作者
王泽华
周国云
洪延
何为
朱永康
黄清华
Wang Zehua;Zhou Guoyun;Hong Yan;He Wei;Zhu Yongkang;Huang Qinghua
出处
《印制电路信息》
2022年第S01期35-39,共5页
Printed Circuit Information
基金
珠海市科技计划项目(No.ZH22044702190033HJL)
关键词
多层挠性性电路
弹塑性变形
线路阻抗
有限元分析
时域反射法
Multilayer Flexible Circuits
Elastic-Plastic Deformation
Line Impedance
Finite Element Analysis
Time Domain Reflectometry
作者简介
第一作者:王泽华,电子科技大学材料与能源学院在读研究生,师从洪延副研究员,专业方向化学工程与技术,主要研究纳米材料的制备和应用及印制电子与印制电路相关技术研究。
