摘要
随着电子通信技术的飞速发展,为了减少趋皮效应所带来的高频高速信号损失,使得高频高速材料搭配低轮廓铜箔的设计,在5G毫米波、雷达等高端产品上的应用越来越广泛。文章将对低轮廓铜箔与不同高频高速板材的结合力影响因素进行分析,测试了不同等级的低轮廓铜箔搭配高频高速板材的剥离强度,并设计对比实验优化工艺,改善低轮廓铜箔较低剥离强度下CO_(2)激光直接钻孔带来的盲孔孔口剥离问题,以满足生产需求。
With the rapid development of electronic communication technology,in order to reduce the loss of high frequency and high speed signal caused by the skin effect,it is increasingly widely used in high-end products such as 5G millimeter wave and radar.This paper will analyze the influence factors of high frequency high speed low profile copper foil with different boards binding force.It tested the different grade of low profile copper foil with high frequency high speed sheet peel strength,and designed experiments to optimize the process,to improve the low profile with low copper foil peel strength under CO_(2)laser direct blind hole orifice dissection of the problems of drilling,so as to meet the production requirements.
作者
王红月
刘涌
Wang Hongyue;Liu Yong
出处
《印制电路信息》
2023年第S01期76-85,共10页
Printed Circuit Information
关键词
低轮廓铜箔
剥离强度
激光钻孔
Low Profile Copper Foil
Peel Strength
Laser Drilling
作者简介
第一作者:王红月,本科学历,就职于上海美维电子有限公司,研发部工程师,主要从事HDI及5G等新产品的工艺开发与优化工作。
