摘要
制作印制电路板的材料种类繁多,聚四氟乙烯(PTFE)材料的印制电路板(PCB)因其良好的损耗优势被广泛应用于PCB制作。PTFE材料的PCB产品化银后出现的色差发亮问题,严重影响产品的可靠性,该问题一直是困扰业界的难题。本文通过对PCB加工制程研究分析,结合扫描电子显微镜(SEM)方法,确定色差的主要来源是铜结晶的差异,基于对电镀、阻焊、化银等流程对铜结晶差异进行研究,确定影响的关键因子:电镀药水浓度、刷板和烘板效果。最终通过模型建立和模型分析,推导铜结晶差异最优参数模型,经产品结果验证,不良率从80%降低至0,彻底解决化银后发亮问题。
There exist many kinds of materials for making printed circuit boards(PCB),among which PTFE material is widely used in PCB production because of its excellent thermal conductivity.The problem of chromatic aberration after silver production of PTFE materials seriously affects the reliability of the products,which has always been a difficult problem for the industry.In this paper,through the research and analysis of the processing process of PTFE products,combined with SEM method,it is determined that the main source of color difference is the difference of copper crystallization.Based on the study of electroplating,welding resistance,silver and other processes,the key factors affecting copper crystallization are determined:the concentration of electroplating solution,the effect of brushing and baking.Finally,through model establishment and model analysis,the optimal parameter model of copper crystallization difference is deduced.verified by the product results,the defect rate is reduced from 80%to 0,which completely solves the problem of shining after silver.
作者
胡强
王蒙蒙
张斌
Hu Qiang;Wang Mengmeng;Zhang Bin
出处
《印制电路信息》
2023年第S02期327-335,共9页
Printed Circuit Information
关键词
PTFE产品
化银发亮
铜结晶
电镀
超粗化
烘板
PTFE Products
Silver Brightening
Electroplating
Ultra-Coarsening
Copper Crystallization
Baking Plate
作者简介
第一作者:胡强,2022年毕业于太原工业学院,同年就职于深南电路股份有限公司,任基础工艺组湿法工程师,在工作期间,完成露孔镀参数模型建立项目,高厚径比通盲共镀能力提升项目,N+N多次电镀面铜均匀性能力提升项目等其他电镀相关项目的研究。
