摘要
本研究针对ABF(味之素堆积膜)基板的可靠性测试方法进行了探究,基于《IPC-TM-650测试方法手册》和《JEDEC标准》,并通过使用合适的研究方法和途径,收集整理了基板行业主流板厂和封装厂针对ABF基板的可靠性测试项目。研究发现业内当前对于ABF基板仍缺乏一个明确有效、全面统一的成品可靠性测试方案。本研究结果对于规范ABF基板的产品可靠性测试方法,提升ABF基板品质具有重要意义。本文对研究的背景和目的进行了简要介绍,并对研究方法和途径进行了描述,强调了本研究的创新性和研究价值。最后,总结了本研究的主要结论和意义。
This study investigates the reliability test methods of ABF(Ajinomoto Build-up Film)substrates.Based on the"IPC-TM-650 Test Method Manual"and"JEDEC Standards",and through the use of appropriate research methods and approaches,the reliability test items of mainstream substrate manufacturers and packaging factories in the substrate industry for ABF substrates are collected and collated.It is found that there is still a lack of a clear,effective,comprehensive and unified finished product reliability test scheme for ABF substrates in the industry.The results of this study are of great significance for standardizing the product reliability test method of ABF substrates and improving the quality of ABF substrates.This paper briefly introduces the background and purpose of the study,describes the research methods and approaches,and emphasizes the innovation and research value of this study.Finally,the main conclusions and significance of this study are summarized.
作者
李进东
袁成兵
陈庆平
魏永发
赖勇
徐翛晓
Li Jindong;Yuan Chengbing;Chen Qingping;Wei Yongfa;Lai Yong;Xu Xiaoxiao
出处
《印制电路信息》
2024年第S01期278-287,共10页
Printed Circuit Information
作者简介
第一作者:李进东(1989,1—),男,江苏盐城人,管理学学士,奥芯半导体科技(太仓)有限公司,实验室主管。研究方向:ABF基板可靠性测试与失效分析。
