摘要
阐述了用于LED照明的智能电源芯片架构,其将整流桥堆、续流二极管、LDO、MOS、恒流驱动IC、智控CPU/MCU、存储器等相关功能的裸芯片采用2D平面或3D堆叠方式集成封装在同一基板内,介绍了当前国内外多芯封装集成电路的工艺制程,以及几款具有多功能的LED驱动电源芯片设计。智能电源芯片的发展为照明产品的超微化、智能化提供了可行的技术坦途。
This paper describes the architecture of intelligent power supply chip for LED lighting,which uses 2 D plane or 3 D stacking mode to integrate the bare chips of rectifier bridge,continuous current diode,LDO,MOS,constant current drive IC,CPU/MCU,memory and other related functions into the same substrate,introduces the current domestic and foreign multi-core packaging process,as well as the design of several multifunctional LED driver chips.The development of intelligent power supply chip provides a feasible technical support for the miniature and intelligent lighting products.
作者
颜重光
YAN Chongguang(Shanghai Research Institute of Microelectronics,Peking University,Shanghai 201203,China)
出处
《中国照明电器》
2020年第1期7-11,共5页
China Light & Lighting
作者简介
颜重光,高级工程师。主要从事LED驱动集成电路设计研究。
