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QUANTUM MECHANICAL MODEL AND SIMULATION OF GaAs/AlGaAs QUANTUM WELL INFRARED PHOTO-DETECTOR-ⅠOPTICAL ASPECTS 被引量:2
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作者 Fu Y Willander M +1 位作者 Li Ning Lu W 《红外与毫米波学报》 SCIE EI CAS CSCD 北大核心 2002年第5期321-326,共6页
A complete quantum mechanical model for GaAs?AlGaAs quantum well infrared photodetectors(QWIPs) is presented here. The model consisted of four parts: (1) Starting with the description of the electromagnetic field of t... A complete quantum mechanical model for GaAs?AlGaAs quantum well infrared photodetectors(QWIPs) is presented here. The model consisted of four parts: (1) Starting with the description of the electromagnetic field of the infrared radiation in the QWIP, effective component of the vector potential <| A z |> along the QWIP growth direction ( z axis) due to the optical diffraction grating was calculated. (2) From the wave transmissions and the occupations of the electronic states, it was discussed that the dark current in the QWIP is determined by the drift diffusion current of carriers thermally excited from the ground sublevel in the quantum well to extended states above the barrier. (3) The photocurrent was investigated by the optical transition (absorption coefficient between the ground state to excited states due to the nonzero <| A z |> ). (4) By studying the inter diffusion of the Al atoms across the GaAs?AlGaAs heterointerfaces,the mobility of the drift diffusion carriers in the excited states was calculated, so the measurement results of the dark current and photocurrent spectra can be explained theoretically. With the complete quantum mechanical descriptions of (1 4), QWIP device design and optimization are possible. 展开更多
关键词 GAAS/ALGAAS PHOTODETECTOR quantum well infrared photodetector(QWIP) quantum mechanical model
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An improved ASM-HEMT model for kink effect on GaN devices
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作者 WANG Shuai CHENG Ai-Qiang +3 位作者 GE Chen CHEN Dun-Jun LIU Jun DING Da-Zhi 《红外与毫米波学报》 SCIE EI CAS CSCD 北大核心 2024年第4期520-525,共6页
With the analysis of experiment and theory on GaN HEMT devices under DC sweep,an improved model for kink effect based on advanced SPICE model for high electron mobility transistors(ASM-HEMT)is pro⁃posed,considering th... With the analysis of experiment and theory on GaN HEMT devices under DC sweep,an improved model for kink effect based on advanced SPICE model for high electron mobility transistors(ASM-HEMT)is pro⁃posed,considering the relationship between the drain/gate-source voltage and kink effect.The improved model can not only accurately describe the trend of the drain-source current with the current collapse and kink effect,but also precisely fit different values of drain-source voltages at which the kink effect occurs under different gatesource voltages.Furthermore,it well characterizes the DC characteristics of GaN devices in the full operating range,with the fitting error less than 3%.To further verify the accuracy and convergence of the improved model,a load-pull system is built in ADS.The simulated result shows that although both the original ASM-HEMT and the improved model predict the output power for the maximum power matching of GaN devices well,the im⁃proved model predicts the power-added efficiency for the maximum efficiency matching more accurately,with 4%improved. 展开更多
关键词 ASM-HEMT DC current collapse kink effect
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基于非等径双球堆积模型和蒙特卡罗仿真模拟的纳米铜烧结互连机理分析 被引量:2
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作者 蒋大伟 樊嘉杰 +2 位作者 胡栋 樊学军 张国旗 《焊接学报》 EI CAS CSCD 北大核心 2021年第3期7-13,I0001,I0002,共9页
为了满足第三代半导体低温封装、高温服役的要求,纳米金属颗粒烧结封装互连逐渐替代传统钎料回流焊工艺,而高致密度烧结是实现高可靠性封装的必要条件之一.为了研究纳米铜颗粒烧结互连机理,首先通过非等径双球三维密集堆积模型构建理论... 为了满足第三代半导体低温封装、高温服役的要求,纳米金属颗粒烧结封装互连逐渐替代传统钎料回流焊工艺,而高致密度烧结是实现高可靠性封装的必要条件之一.为了研究纳米铜颗粒烧结互连机理,首先通过非等径双球三维密集堆积模型构建理论颗粒配比与堆积孔隙率之间的关系,然后采用蒙特卡罗仿真模拟不同粒径比的双球模型颗粒烧结过程,最后通过纳米铜混合烧结试验来验证理论推算和仿真模拟结果.结果表明,根据3种三维密集堆积模型估算,孔隙率最低时的颗粒粒径比在10∶1~5∶1之间;仿真模拟结果显示,粒径比为5∶1时的双球模型收缩率最大;选择250和50 nm两种粒径纳米铜进行混合烧结试验,证实烧结致密度最佳条件时的颗粒质量比为8∶1,与理论计算结果相符.由此可见,该方法可以为纳米铜烧结在第三代半导体封装互连中的应用和工艺优化提供了理论支持. 展开更多
关键词 第三代半导体 封装互连 纳米铜烧结 蒙特卡罗仿真模拟 致密性
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