The reasons for low output power of AlGalnP Light Emitting Diodes （LEDs） have been analysed. LEDs with AlGaInP material have high internal but low external quantum efficiency and much heat generated inside especiall...The reasons for low output power of AlGalnP Light Emitting Diodes （LEDs） have been analysed. LEDs with AlGaInP material have high internal but low external quantum efficiency and much heat generated inside especially at a large injected current which would reduce both the internal and external quantum efficiencies. Two kinds of LEDs with the same active region but different window layers have been fabricated. The new window layer composed of textured 0.5 μm GaP and thin Indium-Tin-Oxide film has shown that low external quantum efficiency （EQE） has serious impaction on the internal quantum efficiency （IQE）, because the carrier distribution will change with the body temperature increasing due to the heat inside, and the test results have shown the evidence of LEDs with lower output power and bigger wavelength red shift.展开更多
We propose a new method of using conductive glue to agglutinate GaAs based A1CaInP light emitting diodes （LEDs） onto silicon substrate, and the absorbing GaAs layer is subsequently removed by grinding and selective ...We propose a new method of using conductive glue to agglutinate GaAs based A1CaInP light emitting diodes （LEDs） onto silicon substrate, and the absorbing GaAs layer is subsequently removed by grinding and selective wet etching. It was found that A1GaInP-Si glue agglutinated LEDs have larger saturation current and luminous intensity than the conventional LEDs working at the same injected current. The luminous intensity of the new device is as much as 1007.4 mcd at a saturation current of 125 mA without being encapsulated, while the conventional LEDs only have 266.2 mcd at a saturation current of 105 mA. The luminescence intensity is also found to increase by about 3.2% after working at 50 mA for 768 h. This means that the new structured LEDs have good reliability performance.展开更多
We report the study on a short wavelength-tunable vertical-cavity surface-emitting laser utilizing a monolithically integrated bridge tuning microelectromechanical system. A deformable-bridge top mirror suspended abov...We report the study on a short wavelength-tunable vertical-cavity surface-emitting laser utilizing a monolithically integrated bridge tuning microelectromechanical system. A deformable-bridge top mirror suspended above an active region is utilized. Applied bridge-substrate bias produces an electrostatic force which reduces the spacing of air-gap and tunes the resonant wavelength toward a shorter wavelength （blue-shift）, Good laser characteristics are obtained： such as continuous tuning ranges over 11 nm near 940 nm for 0-9 V tuning bias, the peak output power near 1 mW and the full-width-half-maximum limited to approximately 3.2-6.8 rim. A detailed simulation of the micromechanical and optical characteristics of these devices is performed, and the ratio of bridge displacement to wavelength shift has been found to be 3：1.展开更多
The scalability of the tunnel-regenerated multi-active-region （TRMAR） structure has been investigated for the application in light-emitting diodes （LEDs）. The use of the TRMAR structure was proved theoretically to...The scalability of the tunnel-regenerated multi-active-region （TRMAR） structure has been investigated for the application in light-emitting diodes （LEDs）. The use of the TRMAR structure was proved theoretically to have unique advantages over conventional slngle-active-layer structures in virtually every aspect, such as high quantum efficiency, high power and low leakage. Our study showed that the TRMAR LED structure could obtain high output power under low current injection and high wall-plug efficiency compared with the conventional single-active-layer LED structure.展开更多
A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon subm...A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon submount. Electronic luminance （EL） test reveals that the luminance flux is 130% higher than that of the conventional LED made from the same LED wafer. Current-voltage （I- V） measurement indicates that the bonding processes do not impact the electrical property of AIGalnP LED in the small voltage region （V 〈 1.5 V）. In the large voltage region （V 〉 1.5 V）, the I-V characteristic exhibits space-charge-limited currents characteristic due to the p-GaAs/n-GaN bonding interface.展开更多
High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes （FCLEDs） have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and...High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes （FCLEDs） have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge （ESD） damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard （human body model）, the FCLEDs tolerated at least 10 kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3 V is 144.68 mW, and 236.59 mW at 1.0A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0A without significant power degradation or failure. The li.fe test of FCLEDs is performed at forward current of 200 mA at room temperature. The degradation of the light output power is no more than 9% after 1010.75 h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.展开更多
In this paper a novel A1GalnP thin-film light-emitting diode （LED） with omni-directionally reflector （ODR） and transparent conducting indium tin oxide （ITO） n-type contact structure is proposed, and fabrication ...In this paper a novel A1GalnP thin-film light-emitting diode （LED） with omni-directionally reflector （ODR） and transparent conducting indium tin oxide （ITO） n-type contact structure is proposed, and fabrication process is developed. This reflector is realized with the combination of a low-refractive-index dielectric layer and a high reflectivity metal layer. This allows the light emitted or internally reflected downwardly towards the GaAs substrate at any angle of incidence to be reflected towards the top surface of the chip. ITO n-type contact is used for anti-reflection and current spreading layers on the ODR-LED with ITO. The sheet resistance of the ITO films （95 nm） deposited on n- ohmic contact of ODR-LED is of the order 23.5Ω/△ with up to 90% transmittance （above 92% for 590-770 nm） in the visible region of the spectrum. The optical and electrical characteristics of the ODR-LED with ITO are presented and compared to conventional AS-LED and ODR-LED without ITO. It is shown that the light output from the ODR-LED with ITO at forward current 20mA exceeds that of AS-LED and ODR-LED without ITO by about a factor of 1.63 and 0.16, respectively. A favourable luminous intensity of 218.3 mcd from the ODR-LED with ITO （peak wavelength 620 nm） could be obtained under 20 mA injection, which is 2.63 times and 1.21 times higher than that of AS-LED and ODR-LED without ITO, respectively.展开更多
In this paper AlGaInP light emitting diodes with different types of electrodes： Au/Zn/Au-ITO Au/Ti-ITO Au/Ge/Ni-ITO and Au-ITO are fabricated. The photoelectricity properties of those LEDs are studied. The results sh...In this paper AlGaInP light emitting diodes with different types of electrodes： Au/Zn/Au-ITO Au/Ti-ITO Au/Ge/Ni-ITO and Au-ITO are fabricated. The photoelectricity properties of those LEDs are studied. The results show that the Au/Zn/Au electrode greatly improves the performance of LEDs compared with the other electrodes. Because the Au/Zn/Au electrode not only forms a good Ohmic contact with indium tin oxide （ITO）, but also reduces the specific contact resistances between ITO and GaP, which are 1.273× 10^-6 Ω·cm^2 and 1.743× 10^-3 Ω·cm^2 between Au/Zn/Au-ITO and ITO-GaP respectively. Furthermore, the textured Zn/Au-ITO/Zn electrode is designed to improve the performances of LEDs, reduce the forward-voltage of the LED from 1.93 to 1.88 V, and increase the luminous intensity of the LEDs from 126 to 134 mcd when driven at 20 mA.展开更多
The strain fields in a wafer-bonded GaAs/GaN structure are measured by electron backscatter diffraction （EBSD）. Image quality （IQ） of EBSD Kikuchi patterns and rotation angles of crystal lattices as strain sensiti...The strain fields in a wafer-bonded GaAs/GaN structure are measured by electron backscatter diffraction （EBSD）. Image quality （IQ） of EBSD Kikuchi patterns and rotation angles of crystal lattices as strain sensitive parameters axe employed to chaxacterize the distortion and the rotation of crystal lattices in the GaAs-interface-GaN structure, as well as to display the strain fields. The results indicate that the influence region of the strains in the wafer-bonded GaAs/GaN structure is mainly located in GaAs side because the strength of GaAs is weaker than that of GaN. The cross-sectional image of transmission electron microscopy （TEM） further reveals the distortion and the rotation of crystal lattices induced by strains systematically.展开更多
The low-threshold and high-power oxide-confined 850 nm AlInGaAs strained quantum-well （QW） vertical-cavity surface-emitting lasers （VCSELs） based on the intra-cavity contacted structure are fabricated. The thresho...The low-threshold and high-power oxide-confined 850 nm AlInGaAs strained quantum-well （QW） vertical-cavity surface-emitting lasers （VCSELs） based on the intra-cavity contacted structure are fabricated. The threshold current of 0.1 mA for a 10-μm oxide-aperture device is obtained with the threshold current density of 0.127kA/cm^2. For a 22-μm oxide-aperture device, the peak optical output power reaches to 14.6mW at the current injection of 25 mA under the room temperature and pulsed operation with a threshold current of 2mA, which corresponds to the threshold current density of 0.526kA/cm^2. The lasing wavelength is 855.4nm. The full wave at half maximum is 2.2 nm. The analysis of the characteristics and the fabrication of VCSELs are also described.展开更多
GaN-based light-emitting diodes （LEDs） with mesh-contact electrodes have been developed. The p-type ohmic contact layer is composed of oxidized Ni/Au mesh and NiO overlay （20A）. An Ag （3000A） omni-directional re...GaN-based light-emitting diodes （LEDs） with mesh-contact electrodes have been developed. The p-type ohmic contact layer is composed of oxidized Ni/Au mesh and NiO overlay （20A）. An Ag （3000A） omni-directional reflector covers the p-type contact. The n-type contact is a Ti/AI planar film with a 10-μm-width Ti/AI stripe. The Ti/AI stripe surrounds the centre of LED mesa. With a 20-mA current injection, the light output power of GaN-based LEDs with mesh-contact electrodes is 23% higher than that of the conventional LEDs.展开更多
基金Project supported by the National High Technology Research and Development Program of China(Grant No.2006AA03A121)the National Basic Research Program of China(Grant No.2006CB604900)
文摘The reasons for low output power of AlGalnP Light Emitting Diodes （LEDs） have been analysed. LEDs with AlGaInP material have high internal but low external quantum efficiency and much heat generated inside especially at a large injected current which would reduce both the internal and external quantum efficiencies. Two kinds of LEDs with the same active region but different window layers have been fabricated. The new window layer composed of textured 0.5 μm GaP and thin Indium-Tin-Oxide film has shown that low external quantum efficiency （EQE） has serious impaction on the internal quantum efficiency （IQE）, because the carrier distribution will change with the body temperature increasing due to the heat inside, and the test results have shown the evidence of LEDs with lower output power and bigger wavelength red shift.
基金Project supported by the National High Technology Research and Development Program of China (Grant No. 2006AA03A121)the National Basic Research Program of China (Grant No. 2006CB604900)
文摘We propose a new method of using conductive glue to agglutinate GaAs based A1CaInP light emitting diodes （LEDs） onto silicon substrate, and the absorbing GaAs layer is subsequently removed by grinding and selective wet etching. It was found that A1GaInP-Si glue agglutinated LEDs have larger saturation current and luminous intensity than the conventional LEDs working at the same injected current. The luminous intensity of the new device is as much as 1007.4 mcd at a saturation current of 125 mA without being encapsulated, while the conventional LEDs only have 266.2 mcd at a saturation current of 105 mA. The luminescence intensity is also found to increase by about 3.2% after working at 50 mA for 768 h. This means that the new structured LEDs have good reliability performance.
基金Project supported by the National Natural Science Foundation of China （Grant No 60506012）, the Fok Ying-Tong Foundation （Grant No 101062）, the Natural Science Foundation of Beijing China （Grant No KZ200510005003）, the Science Star of Beijing China （Grant No 2005A11）, and the Funding Project for Academic Human Resources Development in Institutions of Higher Learning Under the Jurisdiction of Beijing Municipality China （Grant No 20051D0501502）.Acknowledgement The authors gratefully acknowledge the staff of M0CVD, Zhou Deshu, and Han Jinru for technical assistance. The authors also thank Professor Academician Chen Lianghui, Professor Tan Manqing and Mr Wang Xuming at the Institute of Semiconductors, CAS for technological support in device fabrication.
文摘We report the study on a short wavelength-tunable vertical-cavity surface-emitting laser utilizing a monolithically integrated bridge tuning microelectromechanical system. A deformable-bridge top mirror suspended above an active region is utilized. Applied bridge-substrate bias produces an electrostatic force which reduces the spacing of air-gap and tunes the resonant wavelength toward a shorter wavelength （blue-shift）, Good laser characteristics are obtained： such as continuous tuning ranges over 11 nm near 940 nm for 0-9 V tuning bias, the peak output power near 1 mW and the full-width-half-maximum limited to approximately 3.2-6.8 rim. A detailed simulation of the micromechanical and optical characteristics of these devices is performed, and the ratio of bridge displacement to wavelength shift has been found to be 3：1.
基金Project supported by the National Basic Research Program of China (Grant No 2006CB604902)the National High Technology Development Program of China (Grant No 2006AA03A121)+4 种基金the National Natural Science Foundation of China (Grant No 60506012)Beijing Natural Science Foundation (Grant No KZ200510005003)Fok Ying Tung Education Foundation (Grant No 101062)Excellent PhD Thesis Foundation (Grant No 200542),Beijing New-Star Program of China (Grant No 2005A11)
文摘The scalability of the tunnel-regenerated multi-active-region （TRMAR） structure has been investigated for the application in light-emitting diodes （LEDs）. The use of the TRMAR structure was proved theoretically to have unique advantages over conventional slngle-active-layer structures in virtually every aspect, such as high quantum efficiency, high power and low leakage. Our study showed that the TRMAR LED structure could obtain high output power under low current injection and high wall-plug efficiency compared with the conventional single-active-layer LED structure.
基金Supported by the National Basic Research Program of China under Grant No 2006CB604902, the National High Technology Research and Development Program of China under Grant No 2006AA03A121 the National Natural Science Foundation of China under Grant No 60506012, the Fok Ying Tong Foundation under Grant No 101062, the Beijing Municipal Commission of Education （KZ200510005003, 05002015200504）, and the Excellent PhD Thesis Foundation of High Education of China （200542）.
文摘A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon submount. Electronic luminance （EL） test reveals that the luminance flux is 130% higher than that of the conventional LED made from the same LED wafer. Current-voltage （I- V） measurement indicates that the bonding processes do not impact the electrical property of AIGalnP LED in the small voltage region （V 〈 1.5 V）. In the large voltage region （V 〉 1.5 V）, the I-V characteristic exhibits space-charge-limited currents characteristic due to the p-GaAs/n-GaN bonding interface.
文摘High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes （FCLEDs） have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge （ESD） damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard （human body model）, the FCLEDs tolerated at least 10 kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3 V is 144.68 mW, and 236.59 mW at 1.0A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0A without significant power degradation or failure. The li.fe test of FCLEDs is performed at forward current of 200 mA at room temperature. The degradation of the light output power is no more than 9% after 1010.75 h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.
文摘In this paper a novel A1GalnP thin-film light-emitting diode （LED） with omni-directionally reflector （ODR） and transparent conducting indium tin oxide （ITO） n-type contact structure is proposed, and fabrication process is developed. This reflector is realized with the combination of a low-refractive-index dielectric layer and a high reflectivity metal layer. This allows the light emitted or internally reflected downwardly towards the GaAs substrate at any angle of incidence to be reflected towards the top surface of the chip. ITO n-type contact is used for anti-reflection and current spreading layers on the ODR-LED with ITO. The sheet resistance of the ITO films （95 nm） deposited on n- ohmic contact of ODR-LED is of the order 23.5Ω/△ with up to 90% transmittance （above 92% for 590-770 nm） in the visible region of the spectrum. The optical and electrical characteristics of the ODR-LED with ITO are presented and compared to conventional AS-LED and ODR-LED without ITO. It is shown that the light output from the ODR-LED with ITO at forward current 20mA exceeds that of AS-LED and ODR-LED without ITO by about a factor of 1.63 and 0.16, respectively. A favourable luminous intensity of 218.3 mcd from the ODR-LED with ITO （peak wavelength 620 nm） could be obtained under 20 mA injection, which is 2.63 times and 1.21 times higher than that of AS-LED and ODR-LED without ITO, respectively.
基金supported by the Natural Science Foundation of Beijing,China (Grant No.4092007)the National High Technology Research and Development Program of China (Grant No.2008AA03Z402)+1 种基金the Doctoral Program Foundation of Beijing,China(Grant No.X0002013200801)the Seventh BJUT Technology Fund for postgraduate students,China
文摘In this paper AlGaInP light emitting diodes with different types of electrodes： Au/Zn/Au-ITO Au/Ti-ITO Au/Ge/Ni-ITO and Au-ITO are fabricated. The photoelectricity properties of those LEDs are studied. The results show that the Au/Zn/Au electrode greatly improves the performance of LEDs compared with the other electrodes. Because the Au/Zn/Au electrode not only forms a good Ohmic contact with indium tin oxide （ITO）, but also reduces the specific contact resistances between ITO and GaP, which are 1.273× 10^-6 Ω·cm^2 and 1.743× 10^-3 Ω·cm^2 between Au/Zn/Au-ITO and ITO-GaP respectively. Furthermore, the textured Zn/Au-ITO/Zn electrode is designed to improve the performances of LEDs, reduce the forward-voltage of the LED from 1.93 to 1.88 V, and increase the luminous intensity of the LEDs from 126 to 134 mcd when driven at 20 mA.
基金Supported by the National Basic Research Programme of China under Grant No 2006CB604902, the National High Technology Research and Development Programme of China under Grant No 2006AA03A121, and the National Natural Science Foundation of China under Grant No 60506012.
文摘The strain fields in a wafer-bonded GaAs/GaN structure are measured by electron backscatter diffraction （EBSD）. Image quality （IQ） of EBSD Kikuchi patterns and rotation angles of crystal lattices as strain sensitive parameters axe employed to chaxacterize the distortion and the rotation of crystal lattices in the GaAs-interface-GaN structure, as well as to display the strain fields. The results indicate that the influence region of the strains in the wafer-bonded GaAs/GaN structure is mainly located in GaAs side because the strength of GaAs is weaker than that of GaN. The cross-sectional image of transmission electron microscopy （TEM） further reveals the distortion and the rotation of crystal lattices induced by strains systematically.
基金Supported by the National Natural Science Foundation of China under Grant Nos 60276033 and 60506012, the National High Technology Research and Development Programme of China under Grant Nos 2002AA312070 and 2004AA311030, and the Natural Science Foundation of Beijing under Grant No K2200510005003.
文摘The low-threshold and high-power oxide-confined 850 nm AlInGaAs strained quantum-well （QW） vertical-cavity surface-emitting lasers （VCSELs） based on the intra-cavity contacted structure are fabricated. The threshold current of 0.1 mA for a 10-μm oxide-aperture device is obtained with the threshold current density of 0.127kA/cm^2. For a 22-μm oxide-aperture device, the peak optical output power reaches to 14.6mW at the current injection of 25 mA under the room temperature and pulsed operation with a threshold current of 2mA, which corresponds to the threshold current density of 0.526kA/cm^2. The lasing wavelength is 855.4nm. The full wave at half maximum is 2.2 nm. The analysis of the characteristics and the fabrication of VCSELs are also described.
基金Supported by the National Natural Science Foundation of Beijing under Grant No 4002003, and the National Basic Research Programme of China under Grant No 2006CB604902.
文摘GaN-based light-emitting diodes （LEDs） with mesh-contact electrodes have been developed. The p-type ohmic contact layer is composed of oxidized Ni/Au mesh and NiO overlay （20A）. An Ag （3000A） omni-directional reflector covers the p-type contact. The n-type contact is a Ti/AI planar film with a 10-μm-width Ti/AI stripe. The Ti/AI stripe surrounds the centre of LED mesa. With a 20-mA current injection, the light output power of GaN-based LEDs with mesh-contact electrodes is 23% higher than that of the conventional LEDs.
