To understand the dynamic characteristics of the whole period of a complex structure's launching out of water, on the basis of FEM formulations deduced for solving coupled fluid-structure problems with strong-coup...To understand the dynamic characteristics of the whole period of a complex structure's launching out of water, on the basis of FEM formulations deduced for solving coupled fluid-structure problems with strong-coupled method, FE models used to simulate the structure surrounded with fluid domains are established. The modal experiment on the real structure under shallow water shows great accordance with simulating results. Based on this verification, dynamic character parameters of all FE models simulating each phase of the structure's launching out of water are abstracted with unsymmetric algorithm, which can comprehensively describe the dynamic characters of the structure in its whole working process. Conclusions drawned from these calculations are successfully applied in works of evaluating the structure's performances and reliabilities.展开更多
An algorithm integrating reduced order model(ROM),equivalent linearization(EL),and finite element method(FEM)is proposed to carry out geometrically nonlinear random vibration analysis of stiffened plates under acousti...An algorithm integrating reduced order model(ROM),equivalent linearization(EL),and finite element method(FEM)is proposed to carry out geometrically nonlinear random vibration analysis of stiffened plates under acoustic pressure loading.Based on large deflection finite element formulation,the nonlinear equations of motion of stiffened plates are obtained.To reduce the computation,a reduced order model of the structures is established.Then the EL technique is incorporated into FE software NASTRAN by the direct matrix abstraction program(DMAP).For the stiffened plates,a finite element model of beam and plate assembly is established,in which the nodes of beam elements are shared with shell elements,and the offset and section properties of the beam are set.The presented method can capture the root-mean-square(RMS) of the stress responses of shell and beam elements of stiffened plates,and analyze the stress distribution of the stiffened surface and the unstiffened surface,respectively.Finally,the statistical dynamic response results obtained by linear and EL methods are compared.It is shown that the proposed method can be used to analyze the geometrically nonlinear random responses of stiffened plates.The geometric nonlinearity plays an important role in the vibration response of stiffened plates,particularly at high acoustic pressure loading.展开更多
In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is...In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.展开更多
文摘To understand the dynamic characteristics of the whole period of a complex structure's launching out of water, on the basis of FEM formulations deduced for solving coupled fluid-structure problems with strong-coupled method, FE models used to simulate the structure surrounded with fluid domains are established. The modal experiment on the real structure under shallow water shows great accordance with simulating results. Based on this verification, dynamic character parameters of all FE models simulating each phase of the structure's launching out of water are abstracted with unsymmetric algorithm, which can comprehensively describe the dynamic characters of the structure in its whole working process. Conclusions drawned from these calculations are successfully applied in works of evaluating the structure's performances and reliabilities.
基金supported by the National Natural Science Foundations of China(Nos.11872079,11572109)the Science and Technology Project of Hebei Education Department(No.QN2019135)Advanced Talents Incubation Program of the Hebei University(No.521000981285)。
文摘An algorithm integrating reduced order model(ROM),equivalent linearization(EL),and finite element method(FEM)is proposed to carry out geometrically nonlinear random vibration analysis of stiffened plates under acoustic pressure loading.Based on large deflection finite element formulation,the nonlinear equations of motion of stiffened plates are obtained.To reduce the computation,a reduced order model of the structures is established.Then the EL technique is incorporated into FE software NASTRAN by the direct matrix abstraction program(DMAP).For the stiffened plates,a finite element model of beam and plate assembly is established,in which the nodes of beam elements are shared with shell elements,and the offset and section properties of the beam are set.The presented method can capture the root-mean-square(RMS) of the stress responses of shell and beam elements of stiffened plates,and analyze the stress distribution of the stiffened surface and the unstiffened surface,respectively.Finally,the statistical dynamic response results obtained by linear and EL methods are compared.It is shown that the proposed method can be used to analyze the geometrically nonlinear random responses of stiffened plates.The geometric nonlinearity plays an important role in the vibration response of stiffened plates,particularly at high acoustic pressure loading.
文摘In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.
