Surface-enhanced IR absorption spectroscopy in attenuated-total reflection（ATR-SEIRAS） configuration was extended for the first time to a cadmium electrode with the adsorption of pyridine as the model system. The SE...Surface-enhanced IR absorption spectroscopy in attenuated-total reflection（ATR-SEIRAS） configuration was extended for the first time to a cadmium electrode with the adsorption of pyridine as the model system. The SEIRAS active Cd film electrode was prepared by electrodeposition of Cd mulitlayers onto a underlying Au nanofilm on Si in 0.01 mol/L CdSO 4 +0.1 mol/L KClO 4. The morphology of the as-prepared Cd film exhibits an island structure. In the potential range of -1.2 to -0.8 V（vs. SCE）, only in-plane vibrations belonging to the A1 symmetry were detected whereas those to the B1 symmetry virtually were not, suggesting that pyridine coordinates vertically or at a little angle to the Cd electrode surface via its nitrogen end without edge-tilted rotation of its ring plane. The Py adsorption configuration is closed to that found on a Au electrode, but different from that on a Ni or Pt electrode, which may be assigned to different structures of valence electron shells for the substrate metals.展开更多
Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic proces...Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 μm. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.展开更多
文摘Surface-enhanced IR absorption spectroscopy in attenuated-total reflection（ATR-SEIRAS） configuration was extended for the first time to a cadmium electrode with the adsorption of pyridine as the model system. The SEIRAS active Cd film electrode was prepared by electrodeposition of Cd mulitlayers onto a underlying Au nanofilm on Si in 0.01 mol/L CdSO 4 +0.1 mol/L KClO 4. The morphology of the as-prepared Cd film exhibits an island structure. In the potential range of -1.2 to -0.8 V（vs. SCE）, only in-plane vibrations belonging to the A1 symmetry were detected whereas those to the B1 symmetry virtually were not, suggesting that pyridine coordinates vertically or at a little angle to the Cd electrode surface via its nitrogen end without edge-tilted rotation of its ring plane. The Py adsorption configuration is closed to that found on a Au electrode, but different from that on a Ni or Pt electrode, which may be assigned to different structures of valence electron shells for the substrate metals.
文摘Selective metallization on glass is widely used in the production of printed circuit boards(PCB),display panels and solar cells. Selective masking and etching steps are used in the traditional photolithographic processes to create the regions of metallization on non-conducting substrates; however, these processes require high-cost facilities and complicated operations. To address these issues, a non-photolithographic process to form metal patterns on glass was proposed and put into practice, which combines self-assembly of aminosilane, desktop inkjet printing of a catalyst ink, and selective electroless plating of Au, Cu or Ni-B alloy on the catalyst template to form desired patterns with a minimal line width of about 200 μm. The adherence of the metal layer deposited on glass is significantly enhanced due to the surface modification of self-assembled aminosilane layer. The non-photolithographic approach could be cost-effective for prototype and small patch of production of metallic patterns, simple electric circuits and other electronic device parts.
