Although it has a significant advantage in gain properties,the lack of selective etching processes hinders ZnO lasing in on-chip applications.Herein,the circular ZnO microdisk pivoted on Si substrate is fabricated thr...Although it has a significant advantage in gain properties,the lack of selective etching processes hinders ZnO lasing in on-chip applications.Herein,the circular ZnO microdisk pivoted on Si substrate is fabricated through depositing ZnO on patterned silicon on an insulator(SOI)substrate.The cavity structure,morphology,and photoluminescence(PL)properties are studied systematically.The cavity shows a well-defined circular structure with oxygen vacancies.Under the synergistic action of surface tension and stress,the ZnO microdisk shows a unique toroid structure with a high sidewall surface finish.The ZnO microcavity(8μm in diameter)shows optically pumped whispering gallery modes(WGMs)lasing in the ultraviolet region with a Q factor exceeding 1300.More interestingly,the quality of the toroid ZnO microdisk cavity is high enough to support the bandgap renormalization(BGR)phenomenon.With the increasing pumping power,the lasing spectra will be modulated.The lasing spectrum undergoes a Burstein-Moss(BM)effect-induced blueshift and an electron-hole plasma(EHP)effect-induced redshift.展开更多
阐述一种基于Moldex3D仿真的封装可靠性的教学性实验的设计,包括有限元模型的建立、模拟仿真、结果分析与讨论等。根据模拟EMC(Epoxy Molding Compound)填充过程,分析SiP(System in Package)封装在转注成型过程中其空洞的分布和数量,比...阐述一种基于Moldex3D仿真的封装可靠性的教学性实验的设计,包括有限元模型的建立、模拟仿真、结果分析与讨论等。根据模拟EMC(Epoxy Molding Compound)填充过程,分析SiP(System in Package)封装在转注成型过程中其空洞的分布和数量,比较和优化浇口位置和数量设计,从而对模型进行设计并降低封装的空洞风险数量。展开更多
文摘Although it has a significant advantage in gain properties,the lack of selective etching processes hinders ZnO lasing in on-chip applications.Herein,the circular ZnO microdisk pivoted on Si substrate is fabricated through depositing ZnO on patterned silicon on an insulator(SOI)substrate.The cavity structure,morphology,and photoluminescence(PL)properties are studied systematically.The cavity shows a well-defined circular structure with oxygen vacancies.Under the synergistic action of surface tension and stress,the ZnO microdisk shows a unique toroid structure with a high sidewall surface finish.The ZnO microcavity(8μm in diameter)shows optically pumped whispering gallery modes(WGMs)lasing in the ultraviolet region with a Q factor exceeding 1300.More interestingly,the quality of the toroid ZnO microdisk cavity is high enough to support the bandgap renormalization(BGR)phenomenon.With the increasing pumping power,the lasing spectra will be modulated.The lasing spectrum undergoes a Burstein-Moss(BM)effect-induced blueshift and an electron-hole plasma(EHP)effect-induced redshift.
文摘阐述一种基于Moldex3D仿真的封装可靠性的教学性实验的设计,包括有限元模型的建立、模拟仿真、结果分析与讨论等。根据模拟EMC(Epoxy Molding Compound)填充过程,分析SiP(System in Package)封装在转注成型过程中其空洞的分布和数量,比较和优化浇口位置和数量设计,从而对模型进行设计并降低封装的空洞风险数量。
