The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the micr...The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the microstructure feature,texture evolution,mechanical properties,and electrical conductivity of ultrafine wires ranging fromΦ361μm toΦ18μm is performed.Specially,the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized.The results show that the average lamella thickness decreases from 1.63μm to 102 nm during the drawing process.Whereas,inhomogeneous texture evolution across different wire sections was observed.The main texture types of copper wires are comprised of<111>,<001>and<112>orientations.Specifically,the peripheral region is primarily dominated by<111>and<112>,while the central region is dominated by<001>and<111>.As the drawing strain increases,the volume fraction of hard orientation<111>with low Schmid factor increases,where notably higher fraction of<111>is resulted from the consumption of<112>and<001>for the wire ofΦ18μm.For drawn copper wire of 18μm,superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9%IACS.Furthermore,it is found that grain strengthening,dislocation strengthening,and texture strengthening are three primary strengthening mechanisms of drawn copper wire,while the dislocation density is the main factor on the reducing of conductivity.展开更多
基金Project supported by“Unveiled the List of Commanders”Key Core Common Technology Projects of Ji’an,ChinaProject(LJKMZ20220591)supported by the Basic Scientific Research Project of the Education Department of Liaoning Province,ChinaProject(CSTB2023NSCQ-LZX0116)supported by the Natural Science Foundation Joint Fund for Innovation and Development Projects of Chongqing,China。
文摘The ultrafine copper wire with a diameter of 18μm is prepared via cold drawing process from the single crystal downcast billet(Φ8 mm),taking a drawing strain to 12.19.In this paper,in-depth investigation of the microstructure feature,texture evolution,mechanical properties,and electrical conductivity of ultrafine wires ranging fromΦ361μm toΦ18μm is performed.Specially,the microstructure feature and texture type covering the whole longitudinal section of ultrafine wires are elaborately characterized.The results show that the average lamella thickness decreases from 1.63μm to 102 nm during the drawing process.Whereas,inhomogeneous texture evolution across different wire sections was observed.The main texture types of copper wires are comprised of<111>,<001>and<112>orientations.Specifically,the peripheral region is primarily dominated by<111>and<112>,while the central region is dominated by<001>and<111>.As the drawing strain increases,the volume fraction of hard orientation<111>with low Schmid factor increases,where notably higher fraction of<111>is resulted from the consumption of<112>and<001>for the wire ofΦ18μm.For drawn copper wire of 18μm,superior properties are obtained with a tensile strength of 729.8 MPa and an electrical conductivity of 86.9%IACS.Furthermore,it is found that grain strengthening,dislocation strengthening,and texture strengthening are three primary strengthening mechanisms of drawn copper wire,while the dislocation density is the main factor on the reducing of conductivity.
基金国家高技术研究发展计划( 863)( the National High- Tech Research and Development Plan of China under Grant No.2006AA02Z499)兰州交通大学校科研基金( the Science Research Foundation of Lanzhou Jiaotong Uiversity)
