Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to...Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.展开更多
VoIP(Voice Over IP)和WLAN(Wireless LAN)两种主导技术的结合,产生了一种新的应用,VoIP on WLAN(无线局域网上的VoIP).本文在系统分析WLAN和VoIP相关技术的基础上,设计实现了一个基于嵌入式平台WinCE的VoIP无线终端软件,并给出了测试...VoIP(Voice Over IP)和WLAN(Wireless LAN)两种主导技术的结合,产生了一种新的应用,VoIP on WLAN(无线局域网上的VoIP).本文在系统分析WLAN和VoIP相关技术的基础上,设计实现了一个基于嵌入式平台WinCE的VoIP无线终端软件,并给出了测试结果和评价.展开更多
Electric power is widely used as the main energy source of ship integrated power system(SIPS), which contains power network and electric power network. SIPS network reconfiguration is a non-linear large-scale problem....Electric power is widely used as the main energy source of ship integrated power system(SIPS), which contains power network and electric power network. SIPS network reconfiguration is a non-linear large-scale problem. The reconfiguration solution influences the safety and stable operation of the power system. According to the operational characteristics of SIPS, a simplified model of power network and a mathematical model for network reconfiguration are established. Based on these models, a multi-agent and ant colony optimization(MAACO) is proposed to solve the problem of network reconfiguration. The simulations are carried out to demonstrate that the optimization method can reconstruct the integrated power system network accurately and efficiently.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.52475166,52175148)the Regional Collaboration Project of Shanxi Province(Grant No.202204041101044).
文摘Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.
文摘VoIP(Voice Over IP)和WLAN(Wireless LAN)两种主导技术的结合,产生了一种新的应用,VoIP on WLAN(无线局域网上的VoIP).本文在系统分析WLAN和VoIP相关技术的基础上,设计实现了一个基于嵌入式平台WinCE的VoIP无线终端软件,并给出了测试结果和评价.
基金supported by the National Natural Science Foundation of China (4177402141974005)。
文摘Electric power is widely used as the main energy source of ship integrated power system(SIPS), which contains power network and electric power network. SIPS network reconfiguration is a non-linear large-scale problem. The reconfiguration solution influences the safety and stable operation of the power system. According to the operational characteristics of SIPS, a simplified model of power network and a mathematical model for network reconfiguration are established. Based on these models, a multi-agent and ant colony optimization(MAACO) is proposed to solve the problem of network reconfiguration. The simulations are carried out to demonstrate that the optimization method can reconstruct the integrated power system network accurately and efficiently.
