The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the developme...The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m^(−1)·K^(−1),4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.展开更多
The advent of the 5G era has stimulated the rapid development of high power electronics with dense integration.Three-dimensional(3D)thermally conductive networks,possessing high thermal and electrical conductivities a...The advent of the 5G era has stimulated the rapid development of high power electronics with dense integration.Three-dimensional(3D)thermally conductive networks,possessing high thermal and electrical conductivities and many different structures,are regarded as key materials to improve the performance of electronic devices.We provide a critical overview of carbonbased 3D thermally conductive networks,emphasizing their preparation-structure-property relationships and their applications in different scenarios.A detailed discussion of the microscopic principles of thermal conductivity is provided,which is crucial for increasing it.This is followed by an in-depth account of the construction of 3D networks using different carbon materials,such as graphene,carbon foam,and carbon nanotubes.Techniques for the assembly of two-dimensional graphene into 3D networks and their effects on thermal conductivity are emphasized.Finally,the existing challenges and future prospects for 3D carbon-based thermally conductive networks are discussed.展开更多
A modified hot wire method was applied to measure the thermal conductivity of different kinds of parti culate materials. With a cylindrical device, a heating rod and two thermocouples, the measurement can be finished...A modified hot wire method was applied to measure the thermal conductivity of different kinds of parti culate materials. With a cylindrical device, a heating rod and two thermocouples, the measurement can be finished within several minutes. Compared with the reference data, the results obtained from the measurements were quite reasonable.展开更多
The thermal property is one of the key properties for the design of the high-level radioactive waste (HLW) repository. In this study, the thermal properties transient automatic tester (HPP-F) is uesd to study the ther...The thermal property is one of the key properties for the design of the high-level radioactive waste (HLW) repository. In this study, the thermal properties transient automatic tester (HPP-F) is uesd to study the thermal conductivity of multiphase composite buffer/backfill material including the type B-Z and B-Z-P (Here B、Z、P represents bentonite、zeolite and pyrite respectively,the same as in the following.) in different dry density and moisture conditions. The results show that for the same moisture content (dry density), thermal conductivity of specimens increases as the dry density (moisture content) increases. As a result, the type B-Z-P which is highly compacted of 1.8 g/cm3 in dry density and 17.65% in moisture content performs well, it meets the requirements of the IAEA and is easy to be compacted ,so it can be recommend as a alternative material of high level radioactive waste disposal repository buffer/backfilling materials.展开更多
半导电屏蔽层对绝缘层空间电荷的分布起着重要作用,绝缘层中空间电荷积累是制约高压直流(high voltage direct current,HVDC)电缆发展的关键因素之一。采用熔融接枝将氯乙酸丙烯酯(CAAE)接枝到乙烯-丙烯酸丁酯共聚物(ethylene-butyl acr...半导电屏蔽层对绝缘层空间电荷的分布起着重要作用,绝缘层中空间电荷积累是制约高压直流(high voltage direct current,HVDC)电缆发展的关键因素之一。采用熔融接枝将氯乙酸丙烯酯(CAAE)接枝到乙烯-丙烯酸丁酯共聚物(ethylene-butyl acrylate copolymer,EBA)大分子链上,制备了CAAE接枝EBA/炭黑(carbon black,CB)半导电屏蔽料,对其进行了形貌及结构表征,测试了其体积电阻率和其作电极时交联聚乙烯(crosslinked polyethylene,XLPE)绝缘层的空间电荷分布特性及击穿场强,系统研究了CAAE的含量对半导电屏蔽料电性能及XLPE绝缘层空间电荷分布特性和击穿场强的影响。结果表明,CAAE接枝EBA基半导电屏蔽料的体积电阻率随着CAAE含量的增加呈先增加后降低的趋势,CAAE接枝改性半导电屏蔽可以降低XLPE绝缘层中的电场畸变,其中CAAE含量为1.0phr时,接枝改性半导电屏蔽料的体积电阻率最低,相较于EBA/CB作电极时,XLPE中的最大电场畸变率在30、40和80℃时分别降低了43.2%、69.0%和72.4%,不同温度下XLPE的击穿场强得到了明显提高。展开更多
文摘The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m^(−1)·K^(−1),4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.
文摘The advent of the 5G era has stimulated the rapid development of high power electronics with dense integration.Three-dimensional(3D)thermally conductive networks,possessing high thermal and electrical conductivities and many different structures,are regarded as key materials to improve the performance of electronic devices.We provide a critical overview of carbonbased 3D thermally conductive networks,emphasizing their preparation-structure-property relationships and their applications in different scenarios.A detailed discussion of the microscopic principles of thermal conductivity is provided,which is crucial for increasing it.This is followed by an in-depth account of the construction of 3D networks using different carbon materials,such as graphene,carbon foam,and carbon nanotubes.Techniques for the assembly of two-dimensional graphene into 3D networks and their effects on thermal conductivity are emphasized.Finally,the existing challenges and future prospects for 3D carbon-based thermally conductive networks are discussed.
文摘A modified hot wire method was applied to measure the thermal conductivity of different kinds of parti culate materials. With a cylindrical device, a heating rod and two thermocouples, the measurement can be finished within several minutes. Compared with the reference data, the results obtained from the measurements were quite reasonable.
文摘The thermal property is one of the key properties for the design of the high-level radioactive waste (HLW) repository. In this study, the thermal properties transient automatic tester (HPP-F) is uesd to study the thermal conductivity of multiphase composite buffer/backfill material including the type B-Z and B-Z-P (Here B、Z、P represents bentonite、zeolite and pyrite respectively,the same as in the following.) in different dry density and moisture conditions. The results show that for the same moisture content (dry density), thermal conductivity of specimens increases as the dry density (moisture content) increases. As a result, the type B-Z-P which is highly compacted of 1.8 g/cm3 in dry density and 17.65% in moisture content performs well, it meets the requirements of the IAEA and is easy to be compacted ,so it can be recommend as a alternative material of high level radioactive waste disposal repository buffer/backfilling materials.
文摘半导电屏蔽层对绝缘层空间电荷的分布起着重要作用,绝缘层中空间电荷积累是制约高压直流(high voltage direct current,HVDC)电缆发展的关键因素之一。采用熔融接枝将氯乙酸丙烯酯(CAAE)接枝到乙烯-丙烯酸丁酯共聚物(ethylene-butyl acrylate copolymer,EBA)大分子链上,制备了CAAE接枝EBA/炭黑(carbon black,CB)半导电屏蔽料,对其进行了形貌及结构表征,测试了其体积电阻率和其作电极时交联聚乙烯(crosslinked polyethylene,XLPE)绝缘层的空间电荷分布特性及击穿场强,系统研究了CAAE的含量对半导电屏蔽料电性能及XLPE绝缘层空间电荷分布特性和击穿场强的影响。结果表明,CAAE接枝EBA基半导电屏蔽料的体积电阻率随着CAAE含量的增加呈先增加后降低的趋势,CAAE接枝改性半导电屏蔽可以降低XLPE绝缘层中的电场畸变,其中CAAE含量为1.0phr时,接枝改性半导电屏蔽料的体积电阻率最低,相较于EBA/CB作电极时,XLPE中的最大电场畸变率在30、40和80℃时分别降低了43.2%、69.0%和72.4%,不同温度下XLPE的击穿场强得到了明显提高。
