期刊文献+
共找到1篇文章
< 1 >
每页显示 20 50 100
Residual stress induced wetting variation on electric brush-plated Cu film
1
作者 孟可可 江月 +2 位作者 江忠浩 连建设 蒋青 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第3期572-576,共5页
Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller t... Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure. 展开更多
关键词 SUPERHYDROPHILICITY wetting transition residual stress nano indenter
在线阅读 下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部