The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary d...The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation （ODE） in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.展开更多
首先基于分离变量算法(method of separation of variables, MSV)求解了单节流孔静压气体轴承的层流边界层方程,研究了节流孔附近流场特性,阐明了节流孔出口附近压降现象是由于惯性效应导致,并研究了轴承几何参数和供气参数对压降现象...首先基于分离变量算法(method of separation of variables, MSV)求解了单节流孔静压气体轴承的层流边界层方程,研究了节流孔附近流场特性,阐明了节流孔出口附近压降现象是由于惯性效应导致,并研究了轴承几何参数和供气参数对压降现象的影响规律。最终提出了压降现象产生的临界条件为压比为0.940 9,也即压比大于临界压比时,压降现象消失。其次基于质量流量相等原则,结合层流边界层的MSV方法及雷诺方程的解析算法,提出了一种计算节流孔系数的新方法,并研究了轴承的几何参数及供气参数对节流孔系数的影响规律。结果显示,节流孔系数存在着参数敏感和不敏感区域,这是由于当压比小于等于0.6左右时,节流孔系数趋近于一个常数0.86左右。展开更多
基金Project(11102136)supported by the National Natural Science Foundation of ChinaProject(2012ZDK04)supported by the Open Project of Guangxi Key Laboratory of Disaster Prevention and Structural Safety,China
文摘The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation （ODE） in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.
文摘首先基于分离变量算法(method of separation of variables, MSV)求解了单节流孔静压气体轴承的层流边界层方程,研究了节流孔附近流场特性,阐明了节流孔出口附近压降现象是由于惯性效应导致,并研究了轴承几何参数和供气参数对压降现象的影响规律。最终提出了压降现象产生的临界条件为压比为0.940 9,也即压比大于临界压比时,压降现象消失。其次基于质量流量相等原则,结合层流边界层的MSV方法及雷诺方程的解析算法,提出了一种计算节流孔系数的新方法,并研究了轴承的几何参数及供气参数对节流孔系数的影响规律。结果显示,节流孔系数存在着参数敏感和不敏感区域,这是由于当压比小于等于0.6左右时,节流孔系数趋近于一个常数0.86左右。
