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Simulation study of a mixed terminal structure for 4H-SiC merged PiN/Schottky diode 被引量:1
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作者 黄健华 吕红亮 +4 位作者 张玉明 张义门 汤晓燕 陈丰平 宋庆文 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第11期530-533,共4页
In this paper, a mixed terminal structure for the 4H-SiC merged PiN/Schottky diode (MPS) is investigated, which is a combination of a field plate, a junction termination extension and floating limiting rings. Optimi... In this paper, a mixed terminal structure for the 4H-SiC merged PiN/Schottky diode (MPS) is investigated, which is a combination of a field plate, a junction termination extension and floating limiting rings. Optimization is performed on the terminal structure by using the ISE-TCAD. Further analysis shows that this structure can greatly reduce the sensitivity of the breakdown voltage to the doping concentration and can effectively suppress the effect of the interface charge compared with the structure of the junction termination extension. At the same time, the 4H-SiC MPS with this termination structure can reach a high and stable breakdown voltage. 展开更多
关键词 4H-SIC merged pin/schottky diode junction termination technology breakdown volt-age
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Novel layout design of 4H-SiC merged PiN Schottky diodes leading to improved surge robustness
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作者 陈嘉豪 王颖 +2 位作者 费新星 包梦恬 曹菲 《Chinese Physics B》 SCIE EI CAS CSCD 2023年第9期552-558,共7页
A method to improve the surge current capability of silicon carbide(SiC)merged PiN Schottky(MPS)diodes is presented and investigated via three-dimensional electro-thermal simulations.When compared with a conventional ... A method to improve the surge current capability of silicon carbide(SiC)merged PiN Schottky(MPS)diodes is presented and investigated via three-dimensional electro-thermal simulations.When compared with a conventional MPS diode,the proposed structure has a more uniform current distribution during bipolar conduction due to the help of the continuous P+surface,which can avoid the formation of local hotspots during the surge process.The Silvaco simulation results show that the proposed structure has a 20.29%higher surge capability and a 15.06%higher surge energy compared with a conventional MPS diode.The bipolar on-state voltage of the proposed structure is 4.69 V,which is 56.29%lower than that of a conventional MPS diode,enabling the device to enter the bipolar mode earlier during the surge process.Furthermore,the proposed structure can suppress the occurrence of‘snapback'phenomena when switching from the unipolar to the bipolar operation mode.In addition,an analysis of the surge process of MPS diodes is carried out in detail. 展开更多
关键词 merged pin schottky(mps)diode silicon carbide(SiC) surge capability surge energy reliability
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A 4H-SiC merged P–I–N Schottky with floating back-to-back diode 被引量:2
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作者 Wei-Zhong Chen Hai-Feng Qin +3 位作者 Feng Xu Li-Xiang Wang Yi Huang Zheng-Sheng Han 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第2期660-664,共5页
A novel 4 H-Si C merged P–I–N Schottky(MPS)with floating back-to-back diode(FBD),named FBD-MPS,is proposed and investigated by the Sentaurus technology computer-aided design(TCAD)and analytical model.The FBD feature... A novel 4 H-Si C merged P–I–N Schottky(MPS)with floating back-to-back diode(FBD),named FBD-MPS,is proposed and investigated by the Sentaurus technology computer-aided design(TCAD)and analytical model.The FBD features a trench oxide and floating P-shield,which is inserted between the P+/N-(PN)junction and Schottky junction to eliminate the shorted anode effect.The FBD is formed by the N-drift/P-shield/N-drift and it separates the PN and Schottky active region independently.The FBD reduces not only the Vturn to suppress the snapback effect but also the Von at bipolar operation.The results show that the snapback can be completely eliminated,and the maximum electric field(Emax)is shifted from the Schottky junction to the FBD in the breakdown state. 展开更多
关键词 4H-SIC merged P-I-N schottky(mps) snapback effect turnover voltage floating back-to-back diode(FBD)
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碳化硅MPS的功率损耗特性分析 被引量:1
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作者 牛新军 张玉明 +2 位作者 张义门 吕红亮 常远程 《固体电子学研究与进展》 CAS CSCD 北大核心 2003年第2期193-198,共6页
采用解析模型模拟了 4 H-Si C混合 Pi N/Schottky二极管 (MPS)的功率损耗及反向恢复 ,研究了外延层掺杂浓度和厚度、PN结网格宽度等主要的结构参数对该器件功率损耗的影响。模拟结果表明 ,对文中所述的MPS,在 770 K左右具有最小功耗 ,... 采用解析模型模拟了 4 H-Si C混合 Pi N/Schottky二极管 (MPS)的功率损耗及反向恢复 ,研究了外延层掺杂浓度和厚度、PN结网格宽度等主要的结构参数对该器件功率损耗的影响。模拟结果表明 ,对文中所述的MPS,在 770 K左右具有最小功耗 ,且肖特基区所占的面积比越大 ,外延层掺杂浓度越高 ,厚度越小 ,最小功耗越低 ,最小功耗对应的温度也越高。论证了 MPS在一个较高的温度下具有很低的功耗 。 展开更多
关键词 碳化硅 mps 功率损耗 功率器件 器件模拟 pin/schottky二极管
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MPS二极管的少子特性仿真 被引量:2
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作者 孙霞霞 汪再兴 +2 位作者 刘晓忠 郑丽君 王永顺 《半导体技术》 CAS 北大核心 2019年第4期270-275,285,共7页
混合pin/肖特基(MPS)二极管是广泛应用于电子电路中的快恢复功率器件,具有高击穿电压、快速开关和正向电流大等特性。对MPS二极管漂移区的少数载流子的特性进行了仿真分析。仿真结果表明,MPS二极管的p^+区向漂移区注入的少数载流子浓度... 混合pin/肖特基(MPS)二极管是广泛应用于电子电路中的快恢复功率器件,具有高击穿电压、快速开关和正向电流大等特性。对MPS二极管漂移区的少数载流子的特性进行了仿真分析。仿真结果表明,MPS二极管的p^+区向漂移区注入的少数载流子浓度随外加正向电压和pn结面积占元胞总面积比例的增大而增大。虽然漂移区的少数载流子改变了MPS二极管的工作模式,增大了电流,但是存储在漂移区的少数载流子增大了反向峰值电流和恢复时间,进而增大了功耗并降低了关断速度。折中考虑正向电流和反向恢复特性,可获得具有正向电流大、反向峰值电流小和反向恢复时间短的MPS二极管。 展开更多
关键词 混合pin/肖特基(mps)二极管 少数载流子浓度 高频特性 反向恢复时间 漂移区
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MPS快恢复二极管正向压降的研究 被引量:1
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作者 陈天 杨晓鸾 季顺黄 《半导体技术》 CAS CSCD 北大核心 2013年第8期598-602,共5页
介绍了混合pin/肖特基(MPS)二极管快恢复二极管的工作原理,基于人们对与主功率开关器件并联起箝位或缓冲作用的快速二极管提出的高要求即在具有超快和超软恢复特性的同时又兼具有低的正向导通损耗,以减少芯片的发热损耗。采用Silvaco仿... 介绍了混合pin/肖特基(MPS)二极管快恢复二极管的工作原理,基于人们对与主功率开关器件并联起箝位或缓冲作用的快速二极管提出的高要求即在具有超快和超软恢复特性的同时又兼具有低的正向导通损耗,以减少芯片的发热损耗。采用Silvaco仿真软件对MPS结构的两款较快恢复二极管的正向特性进行了研究并实际制作了器件,发现正向压降与衬底掺杂浓度及载流子迁移率关系极大。分析了正向压降的温度特性,结果表明固定掺杂浓度的FRD器件,由于晶格散射对载流子迁移率起主导作用,正向压降呈正温度系数特性;而对于FRED器件,由于杂质散射起主导作用,正向压降呈负温度系数特性。 展开更多
关键词 混合pin/肖特基(mps)二极管 快恢复二极管 正向压降 正温度系数 负温度系数
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