Backscatter communications will play an important role in connecting everything for beyond 5G(B5G)and 6G systems.One open challenge for backscatter communications is that the signals suffer a round-trip path loss so t...Backscatter communications will play an important role in connecting everything for beyond 5G(B5G)and 6G systems.One open challenge for backscatter communications is that the signals suffer a round-trip path loss so that the communication distance is short.In this paper,we first calculate the communication distance upper bounds for both uplink and downlink by measuring the tag sensitivity and reflection coefficient.It is found that the activation voltage of the envelope detection diode of the downlink tag is the main factor limiting the back-scatter communication distance.Based on this analysis,we then propose to implement a low-noise amplifier(LNA)module before the envelope detection at the tag to enhance the incident signal strength.Our experimental results on the hardware platform show that our method can increase the downlink communication range by nearly 20 m.展开更多
设计了一种的低成本、低功耗的10 Gb/s光接收机全差跨阻前置放大电路。该电路由跨阻放大器、限幅放大器和输出缓冲电路组成,其可将微弱的光电流信号转换为摆幅为400 m Vpp的差分电压信号。该全差分前置放大电路采用0.18μm CMOS工艺进...设计了一种的低成本、低功耗的10 Gb/s光接收机全差跨阻前置放大电路。该电路由跨阻放大器、限幅放大器和输出缓冲电路组成,其可将微弱的光电流信号转换为摆幅为400 m Vpp的差分电压信号。该全差分前置放大电路采用0.18μm CMOS工艺进行设计,当光电二极管电容为250 f F时,该光接收机前置放大电路的跨阻增益为92 d BΩ,-3 d B带宽为7.9 GHz,平均等效输入噪声电流谱密度约为23 p A/(0~8 GHz)。该电路采用电源电压为1.8 V时,跨阻放大器功耗为28 m W,限幅放大器功耗为80 m W,输出缓冲器功耗为40 m W,其芯片面积为800μm×1 700μm。展开更多
结合混合微波集成电路（HMIC）工艺和砷化镓单片微波集成电路（MMIC）工艺各自优势,设计制作了一款小型化大功率S波段平衡式限幅MMIC低噪声放大器。采用平衡式结构,提高了限幅功率容量和可靠性。由于金丝键合线的等效电感具有更高Q值,...结合混合微波集成电路（HMIC）工艺和砷化镓单片微波集成电路（MMIC）工艺各自优势,设计制作了一款小型化大功率S波段平衡式限幅MMIC低噪声放大器。采用平衡式结构,提高了限幅功率容量和可靠性。由于金丝键合线的等效电感具有更高Q值,低噪声放大器单片的输入匹配采用外部金丝键合线匹配,有效降低了低噪声放大器单片的噪声系数。限幅器采用混合集成工艺制成,能够耐受较大功率。利用微波仿真软件,设计制作了兰格（Lange）电桥、限幅电路和低噪声放大器输入匹配等电路。最终产品尺寸仅为22 mm×16 mm×6 mm,在2.7~3.5 GHz内增益27~28 d B,噪声系数小于1.3 d B,驻波比小于1.3,该平衡限幅MMIC低噪声放大器可承受功率超过200 W、占空比为15%的脉冲功率冲击。展开更多
基金supported in part by National Natural Science Foundation of China under Grant Nos.61971029 and U22B2004in part by Beijing Municipal Natural Science Foundation under Grant No.L222002.
文摘Backscatter communications will play an important role in connecting everything for beyond 5G(B5G)and 6G systems.One open challenge for backscatter communications is that the signals suffer a round-trip path loss so that the communication distance is short.In this paper,we first calculate the communication distance upper bounds for both uplink and downlink by measuring the tag sensitivity and reflection coefficient.It is found that the activation voltage of the envelope detection diode of the downlink tag is the main factor limiting the back-scatter communication distance.Based on this analysis,we then propose to implement a low-noise amplifier(LNA)module before the envelope detection at the tag to enhance the incident signal strength.Our experimental results on the hardware platform show that our method can increase the downlink communication range by nearly 20 m.
文摘设计了一种的低成本、低功耗的10 Gb/s光接收机全差跨阻前置放大电路。该电路由跨阻放大器、限幅放大器和输出缓冲电路组成,其可将微弱的光电流信号转换为摆幅为400 m Vpp的差分电压信号。该全差分前置放大电路采用0.18μm CMOS工艺进行设计,当光电二极管电容为250 f F时,该光接收机前置放大电路的跨阻增益为92 d BΩ,-3 d B带宽为7.9 GHz,平均等效输入噪声电流谱密度约为23 p A/(0~8 GHz)。该电路采用电源电压为1.8 V时,跨阻放大器功耗为28 m W,限幅放大器功耗为80 m W,输出缓冲器功耗为40 m W,其芯片面积为800μm×1 700μm。
文摘结合混合微波集成电路（HMIC）工艺和砷化镓单片微波集成电路（MMIC）工艺各自优势,设计制作了一款小型化大功率S波段平衡式限幅MMIC低噪声放大器。采用平衡式结构,提高了限幅功率容量和可靠性。由于金丝键合线的等效电感具有更高Q值,低噪声放大器单片的输入匹配采用外部金丝键合线匹配,有效降低了低噪声放大器单片的噪声系数。限幅器采用混合集成工艺制成,能够耐受较大功率。利用微波仿真软件,设计制作了兰格（Lange）电桥、限幅电路和低噪声放大器输入匹配等电路。最终产品尺寸仅为22 mm×16 mm×6 mm,在2.7~3.5 GHz内增益27~28 d B,噪声系数小于1.3 d B,驻波比小于1.3,该平衡限幅MMIC低噪声放大器可承受功率超过200 W、占空比为15%的脉冲功率冲击。
