The normal compression tests on intact samples and artificial joints with different saw-tooth shape under cyclic loading and half-sine waves of different frequencies were performed by using Instron1342 servo-controlle...The normal compression tests on intact samples and artificial joints with different saw-tooth shape under cyclic loading and half-sine waves of different frequencies were performed by using Instron1342 servo-controlled material testing machine. The specimens were made artificially with mortar. The loading frequency ranged from 0.005 Hz to 0.1 Hz. The experimental results show that joint closure curves are non-linear and concave up. The stress-deformation curves under cyclic loading exhibit hysteresis and permanent set that diminish rapidly and keep constant finally on successive cycles. Normal displacement successively decreases from the joint J1 to J2, to J3 under the same normal loads regardless of frequency. Considering the loading frequency effect, normal displacement of joint J1 decreases with increasing the loading frequency except that the loading frequency is 0.05 Hz. Normal displacement of joint J2 increases with increasing the loading frequency. Normal displacement of joint J3 increases with increasing the loading frequency when the frequency ranges from 0.005 Hz to 0.05 Hz. Its normal displacement, however, becomes least when the loading frequency is 0.1 Hz.展开更多
To study the seismic performance and load-transferring mechanism of an innovative precast shear wall(IPSW) involving vertical joints, an experimental investigation and theoretical analysis were successively conducted ...To study the seismic performance and load-transferring mechanism of an innovative precast shear wall(IPSW) involving vertical joints, an experimental investigation and theoretical analysis were successively conducted on two test walls. The test results confirm the feasibility of the novel joints as well as the favorable seismic performance of the walls, even though certain optimization measures should be taken to improve the ductility. The load-transferring mechanism subsequently is theoretically investigated based on the experimental study. The theoretical results show the load-transferring route of the novel joints is concise and definite. During the elastic stage, the vertical shear stress in the connecting steel frame(CSF) distributes uniformly; and each high-strength bolt(HSB)primarily delivers vertical shear force. However, the stress in the CSF redistributes when the walls develop into the elastic-plastic stage. At the ultimate state, the vertical shear stress and horizontal normal stress in the CSF distribute linearly; and the HSBs at both ends of the CSF transfer the maximum shear forces.展开更多
The stability of underground excavations is influenced by discontinuities interspaced in surrounding rock masses as well as the stress condition. In this work, a numerical study was undertaken on the failure behavior ...The stability of underground excavations is influenced by discontinuities interspaced in surrounding rock masses as well as the stress condition. In this work, a numerical study was undertaken on the failure behavior around a circular opening in a rock mass having non-persistent open joints using PFC software package. A parallel-bond stress corrosion(PSC) approach was incorporated to drive the failure of rock mass around the circular opening, such that the whole progressive failure process after excavation was reproduced. Based on the determined micro parameters for intact material and joint segments, the failure process around the circular opening agrees very well with that obtained through laboratory experiment. A subsequent parametric study was then carried out to look into the influence of lateral pressure coefficient, joint dip angle and joint persistency on the failure pattern and crack evolution of the rock mass around the circular opening. Three failure patterns identified are step path failure, planar failure and rotation failure depending on the lateral pressure coefficient. Moreover, the increment of joint dip angle and joint persistency aggravates the rock mass failure around the opening. This study offers guideline on stability estimation of underground excavations.展开更多
The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that ...The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear展开更多
The shear behavior of rock joints is important in solving practical problems of rock mechanics. Three group rock joints with different morphologies are made by cement mortar material and a series of CNL(constant norma...The shear behavior of rock joints is important in solving practical problems of rock mechanics. Three group rock joints with different morphologies are made by cement mortar material and a series of CNL(constant normal loading) shear tests are performed. The influences of the applied normal stress and joint morphology to its shear strength are analyzed. According to the experimental results, the peak dilatancy angle of rock joint decreases with increasing normal stress, but increases with increasing roughness. The shear strength increases with the increasing normal stress and the roughness of rock joint. It is observed that the modes of failure of asperities are tensile, pure shear, or a combination of both. It is suggested that the three-dimensional roughness parameters and the tensile strength are the appropriate parameter for describing the shear strength criterion. A new peak shear criterion is proposed which can be used to predict peak shear strength of rock joints. All the used parameters can be easily obtained by performing tests.展开更多
基金Projects(50490274 50490272) supported by the National Natural Science Foundation of ChinaProject(2002CB412703) supported by theNational Basic Research Program of China
文摘The normal compression tests on intact samples and artificial joints with different saw-tooth shape under cyclic loading and half-sine waves of different frequencies were performed by using Instron1342 servo-controlled material testing machine. The specimens were made artificially with mortar. The loading frequency ranged from 0.005 Hz to 0.1 Hz. The experimental results show that joint closure curves are non-linear and concave up. The stress-deformation curves under cyclic loading exhibit hysteresis and permanent set that diminish rapidly and keep constant finally on successive cycles. Normal displacement successively decreases from the joint J1 to J2, to J3 under the same normal loads regardless of frequency. Considering the loading frequency effect, normal displacement of joint J1 decreases with increasing the loading frequency except that the loading frequency is 0.05 Hz. Normal displacement of joint J2 increases with increasing the loading frequency. Normal displacement of joint J3 increases with increasing the loading frequency when the frequency ranges from 0.005 Hz to 0.05 Hz. Its normal displacement, however, becomes least when the loading frequency is 0.1 Hz.
基金Project(51078077)supported by the National Natural Science Foundation of China
文摘To study the seismic performance and load-transferring mechanism of an innovative precast shear wall(IPSW) involving vertical joints, an experimental investigation and theoretical analysis were successively conducted on two test walls. The test results confirm the feasibility of the novel joints as well as the favorable seismic performance of the walls, even though certain optimization measures should be taken to improve the ductility. The load-transferring mechanism subsequently is theoretically investigated based on the experimental study. The theoretical results show the load-transferring route of the novel joints is concise and definite. During the elastic stage, the vertical shear stress in the connecting steel frame(CSF) distributes uniformly; and each high-strength bolt(HSB)primarily delivers vertical shear force. However, the stress in the CSF redistributes when the walls develop into the elastic-plastic stage. At the ultimate state, the vertical shear stress and horizontal normal stress in the CSF distribute linearly; and the HSBs at both ends of the CSF transfer the maximum shear forces.
基金Project(2013CB036003)supported by the National Basic Research Program of ChinaProjects(51374198,51134001,51404255)supported by the National Natural Science Foundation of ChinaProject(BK20150005)supported by the Natural Science Foundation of Jiangsu Province for Distinguished Youth Scholar,China
文摘The stability of underground excavations is influenced by discontinuities interspaced in surrounding rock masses as well as the stress condition. In this work, a numerical study was undertaken on the failure behavior around a circular opening in a rock mass having non-persistent open joints using PFC software package. A parallel-bond stress corrosion(PSC) approach was incorporated to drive the failure of rock mass around the circular opening, such that the whole progressive failure process after excavation was reproduced. Based on the determined micro parameters for intact material and joint segments, the failure process around the circular opening agrees very well with that obtained through laboratory experiment. A subsequent parametric study was then carried out to look into the influence of lateral pressure coefficient, joint dip angle and joint persistency on the failure pattern and crack evolution of the rock mass around the circular opening. Three failure patterns identified are step path failure, planar failure and rotation failure depending on the lateral pressure coefficient. Moreover, the increment of joint dip angle and joint persistency aggravates the rock mass failure around the opening. This study offers guideline on stability estimation of underground excavations.
文摘The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear
基金Project(41130742)supported by the Key Program of National Natural Science Foundation of ChinaProject(2014CB046904)supportedby the National Basic Research Program of China+1 种基金Project(2011CDA119)supported by Natural Science Foundation of Hubei Province,ChinaProject(40972178)supported by the General Program of National Natural Science Foundation of China
文摘The shear behavior of rock joints is important in solving practical problems of rock mechanics. Three group rock joints with different morphologies are made by cement mortar material and a series of CNL(constant normal loading) shear tests are performed. The influences of the applied normal stress and joint morphology to its shear strength are analyzed. According to the experimental results, the peak dilatancy angle of rock joint decreases with increasing normal stress, but increases with increasing roughness. The shear strength increases with the increasing normal stress and the roughness of rock joint. It is observed that the modes of failure of asperities are tensile, pure shear, or a combination of both. It is suggested that the three-dimensional roughness parameters and the tensile strength are the appropriate parameter for describing the shear strength criterion. A new peak shear criterion is proposed which can be used to predict peak shear strength of rock joints. All the used parameters can be easily obtained by performing tests.
