In wireless sensor networks,ensuring communication security via specific emitter identification(SEI)is crucial.However,existing SEI methods are limited to closed-set scenarios and lack the ability to detect unknown de...In wireless sensor networks,ensuring communication security via specific emitter identification(SEI)is crucial.However,existing SEI methods are limited to closed-set scenarios and lack the ability to detect unknown devices and perform classincremental training.This study proposes a class-incremental open-set SEI approach.The open-set SEI model calculates radiofrequency fingerprints(RFFs)prototypes for known signals and employs a self-attention mechanism to enhance their discriminability.Detection thresholds are set through Gaussian fitting for each class.For class-incremental learning,the algorithm freezes the parameters of the previously trained model to initialize the new model.It designs specific losses:the RFFs extraction distribution difference loss and the prototype transformation distribution difference loss,which force the new model to retain old knowledge while learning new knowledge.The training loss enables learning of new class RFFs.Experimental results demonstrate that the open-set SEI model achieves state-of-theart performance and strong noise robustness.Moreover,the class-incremental learning algorithm effectively enables the model to retain old device RFFs knowledge,acquire new device RFFs knowledge,and detect unknown devices simultaneously.展开更多
Extensive experiments suggest that kurtosis-based fingerprint features are effective for specific emitter identification (SEI). Nevertheless, the lack of mechanistic explanation restricts the use of fingerprint featur...Extensive experiments suggest that kurtosis-based fingerprint features are effective for specific emitter identification (SEI). Nevertheless, the lack of mechanistic explanation restricts the use of fingerprint features to a data-driven technique and fur-ther reduces the adaptability of the technique to other datasets. To address this issue, the mechanism how the phase noise of high-frequency oscillators and the nonlinearity of power ampli-fiers affect the kurtosis of communication signals is investigated. Mathematical models are derived for intentional modulation (IM) and unintentional modulation (UIM). Analysis indicates that the phase noise of high-frequency oscillators and the nonlinearity of power amplifiers affect the kurtosis frequency and amplitude, respectively. A novel SEI method based on frequency and ampli-tude of the signal kurtosis (FA-SK) is further proposed. Simula-tion and real-world experiments validate theoretical analysis and also confirm the efficiency and effectiveness of the proposed method.展开更多
This study aimed to clarify the pathogen composition,biological characteristics,infection patterns,and effective control agents for panicle blight of rice in Heilongjiang Province.Diseased panicles were collected from...This study aimed to clarify the pathogen composition,biological characteristics,infection patterns,and effective control agents for panicle blight of rice in Heilongjiang Province.Diseased panicles were collected from different rice-growing areas in Heilongjiang Province and subjected to tissue isolation,pathogenicity tests,morphological observation,and molecular identification.The primary pathogens identified were Fusarium graminearum,Alternaria alternata and Nigrospora oryzae.The biological characteristics of these three pathogens were systematically investigated.Pathogenicity assays revealed that F.graminearum exhibited the strongest pathogenicity,followed by A.alternata,while N.oryzae was the weakest.In vitro toxicity tests screened highly effective fungicides:75%trifloxystrobin-tebuconazole showed the best inhibitory effect against F.graminearum(EC50=0.0140μg·mL^(-1));30%tebuconazole-azoxystrobin was the most effective against A.alternata(EC50=0.0060μg·mL^(-1))and N.oryzae(EC50=0.0310μg·mL^(-1)).展开更多
Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to...Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.展开更多
基金supported by the National Natural Science Foundation of China(62371465)Taishan Scholar Project of Shandong Province(ts201511020)。
文摘In wireless sensor networks,ensuring communication security via specific emitter identification(SEI)is crucial.However,existing SEI methods are limited to closed-set scenarios and lack the ability to detect unknown devices and perform classincremental training.This study proposes a class-incremental open-set SEI approach.The open-set SEI model calculates radiofrequency fingerprints(RFFs)prototypes for known signals and employs a self-attention mechanism to enhance their discriminability.Detection thresholds are set through Gaussian fitting for each class.For class-incremental learning,the algorithm freezes the parameters of the previously trained model to initialize the new model.It designs specific losses:the RFFs extraction distribution difference loss and the prototype transformation distribution difference loss,which force the new model to retain old knowledge while learning new knowledge.The training loss enables learning of new class RFFs.Experimental results demonstrate that the open-set SEI model achieves state-of-theart performance and strong noise robustness.Moreover,the class-incremental learning algorithm effectively enables the model to retain old device RFFs knowledge,acquire new device RFFs knowledge,and detect unknown devices simultaneously.
基金supported by the Youth Science and Technology Innovation Award of National University of Defense Technology (18/19-QNCXJ)the National Science Foundation of China (62271494)
文摘Extensive experiments suggest that kurtosis-based fingerprint features are effective for specific emitter identification (SEI). Nevertheless, the lack of mechanistic explanation restricts the use of fingerprint features to a data-driven technique and fur-ther reduces the adaptability of the technique to other datasets. To address this issue, the mechanism how the phase noise of high-frequency oscillators and the nonlinearity of power ampli-fiers affect the kurtosis of communication signals is investigated. Mathematical models are derived for intentional modulation (IM) and unintentional modulation (UIM). Analysis indicates that the phase noise of high-frequency oscillators and the nonlinearity of power amplifiers affect the kurtosis frequency and amplitude, respectively. A novel SEI method based on frequency and ampli-tude of the signal kurtosis (FA-SK) is further proposed. Simula-tion and real-world experiments validate theoretical analysis and also confirm the efficiency and effectiveness of the proposed method.
基金Supported by the Green Plant Protection Project in Heilongjiang Province(2130108)the Key R&D Program Project of Heilongjiang Province(2023ZX02B0502)the Heilongjiang Province Rice Modern Agriculture Industry Technology Collaborative Innovation System Project(2025)。
文摘This study aimed to clarify the pathogen composition,biological characteristics,infection patterns,and effective control agents for panicle blight of rice in Heilongjiang Province.Diseased panicles were collected from different rice-growing areas in Heilongjiang Province and subjected to tissue isolation,pathogenicity tests,morphological observation,and molecular identification.The primary pathogens identified were Fusarium graminearum,Alternaria alternata and Nigrospora oryzae.The biological characteristics of these three pathogens were systematically investigated.Pathogenicity assays revealed that F.graminearum exhibited the strongest pathogenicity,followed by A.alternata,while N.oryzae was the weakest.In vitro toxicity tests screened highly effective fungicides:75%trifloxystrobin-tebuconazole showed the best inhibitory effect against F.graminearum(EC50=0.0140μg·mL^(-1));30%tebuconazole-azoxystrobin was the most effective against A.alternata(EC50=0.0060μg·mL^(-1))and N.oryzae(EC50=0.0310μg·mL^(-1)).
基金supported by the National Natural Science Foundation of China(Grant Nos.52475166,52175148)the Regional Collaboration Project of Shanxi Province(Grant No.202204041101044).
文摘Modern warfare demands weapons capable of penetrating substantial structures,which presents sig-nificant challenges to the reliability of the electronic devices that are crucial to the weapon's perfor-mance.Due to miniaturization of electronic components,it is challenging to directly measure or numerically predict the mechanical response of small-sized critical interconnections in board-level packaging structures to ensure the mechanical reliability of electronic devices in projectiles under harsh working conditions.To address this issue,an indirect measurement method using the Bayesian regularization-based load identification was proposed in this study based on finite element(FE)pre-dictions to estimate the load applied on critical interconnections of board-level packaging structures during the process of projectile penetration.For predicting the high-strain-rate penetration process,an FE model was established with elasto-plastic constitutive models of the representative packaging ma-terials(that is,solder material and epoxy molding compound)in which material constitutive parameters were calibrated against the experimental results by using the split-Hopkinson pressure bar.As the impact-induced dynamic bending of the printed circuit board resulted in an alternating tensile-compressive loading on the solder joints during penetration,the corner solder joints in the edge re-gions experience the highest S11 and strain,making them more prone to failure.Based on FE predictions at different structural scales,an improved Bayesian method based on augmented Tikhonov regulariza-tion was theoretically proposed to address the issues of ill-posed matrix inversion and noise sensitivity in the load identification at the critical solder joints.By incorporating a wavelet thresholding technique,the method resolves the problem of poor load identification accuracy at high noise levels.The proposed method achieves satisfactorily small relative errors and high correlation coefficients in identifying the mechanical response of local interconnections in board-level packaging structures,while significantly balancing the smoothness of response curves with the accuracy of peak identification.At medium and low noise levels,the relative error is less than 6%,while it is less than 10%at high noise levels.The proposed method provides an effective indirect approach for the boundary conditions of localized solder joints during the projectile penetration process,and its philosophy can be readily extended to other scenarios of multiscale analysis for highly nonlinear materials and structures under extreme loading conditions.
