In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste a...In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste ad of heat sensitive resin as bonding material in dicing blade is being progress ed by authors. This paper discusses the way in which the mechanical feature of t he new kinds of dicing blades had been greatly improved via adding whisker into light sensitive resin. Considering the enhancing function of whisker in length d irection is greater than that in diameter direction, an electric field was appli ed to make the direction of whisker in resin along with the direction of the load of dicing blade. In the electric field, a whisker in the resin is swerved to the direction of the electric force before the resin is solidified by ultravi olet radiation. The result shows that controlling the direction of whisker in th e resin by applying an electric field can finally greatly improve the mechanical property of dicing blade that can be used in processing the semi-conduct.展开更多
文摘In the recent years, the light sensitive resin has be en greatly improved. Its application includes rapid prototyping, bonding, protec tive coating and sealing. A new application to using light sensitive resin inste ad of heat sensitive resin as bonding material in dicing blade is being progress ed by authors. This paper discusses the way in which the mechanical feature of t he new kinds of dicing blades had been greatly improved via adding whisker into light sensitive resin. Considering the enhancing function of whisker in length d irection is greater than that in diameter direction, an electric field was appli ed to make the direction of whisker in resin along with the direction of the load of dicing blade. In the electric field, a whisker in the resin is swerved to the direction of the electric force before the resin is solidified by ultravi olet radiation. The result shows that controlling the direction of whisker in th e resin by applying an electric field can finally greatly improve the mechanical property of dicing blade that can be used in processing the semi-conduct.
