A three-dimensional finite-element model of slab continuous casting mold was conducted to clarify the effect of cooling structure on thermal behavior of copper plates. The results show that temperature distribution of...A three-dimensional finite-element model of slab continuous casting mold was conducted to clarify the effect of cooling structure on thermal behavior of copper plates. The results show that temperature distribution of hot surface is mainly governed by cooling structure and heat-transfer conditions. For hot surface centricity, maximum surface temperature promotions are 30 ℃and 15 ℃ with thickness increments of copper plates of 5 mm and nickel layers of 1 ram, respectively. The surface temperature without nickel layers is depressed by 10 ℃ when the depth increment of water slots is 2 mm and that with nickel layers adjacent to and away from mold outlet is depressed by 7℃ and 5 ℃, respectively. The specific trend of temperature distribution of transverse sections of copper plates is nearly free of cooling structure, but temperature is changed and its law is similar to the corresponding surface temperature.展开更多
基金Project(51004031) supported by the National Natural Science Foundation of ChinaProject(50925415) supported by the National Outstanding Young Scientist Foundation of China+1 种基金Project(20100042120012) supported by the Special Research Fund for Doctoral Programs of Ministry of Education of ChinaProject(N090402022) supported by the Fundamental Research Funds for the Central Universities of China
文摘A three-dimensional finite-element model of slab continuous casting mold was conducted to clarify the effect of cooling structure on thermal behavior of copper plates. The results show that temperature distribution of hot surface is mainly governed by cooling structure and heat-transfer conditions. For hot surface centricity, maximum surface temperature promotions are 30 ℃and 15 ℃ with thickness increments of copper plates of 5 mm and nickel layers of 1 ram, respectively. The surface temperature without nickel layers is depressed by 10 ℃ when the depth increment of water slots is 2 mm and that with nickel layers adjacent to and away from mold outlet is depressed by 7℃ and 5 ℃, respectively. The specific trend of temperature distribution of transverse sections of copper plates is nearly free of cooling structure, but temperature is changed and its law is similar to the corresponding surface temperature.
