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Thermal properties of open-celled aluminum foams prepared by two infiltration casting methods 被引量:2
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作者 王辉 周向阳 +2 位作者 龙波 文康 杨焘 《Journal of Central South University》 SCIE EI CAS 2014年第7期2567-2571,共5页
Contrastive research was carried out to study the thermal properties of open-celled aluminum foams prepared by counter-gravity infiltration casting system and the traditional process respectively.The experimental resu... Contrastive research was carried out to study the thermal properties of open-celled aluminum foams prepared by counter-gravity infiltration casting system and the traditional process respectively.The experimental results show that the thermal conductivity coefficients of aluminum foams prepared by two different infiltration methods have similar increasing trend with the increase of particle size;along with the reducing porosity,the thermal conductivity coefficients will be enhanced oppositely.However,with the same particle size,the open-celled aluminum foam prepared by the former method has a higher thermal conductivity coefficient obviously.It is largely because that the sample prepared by counter-gravity infiltration casting has a lower void content and better dense crystallization of metal-matrix after the constant pressure process. 展开更多
关键词 open-celled aluminum foams counter-gravity infiltration casting thermal conductivity coefficient particle size POROSITY
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Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming
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作者 郭明海 刘俊友 +2 位作者 贾成厂 贾琪瑾 果世驹 《Journal of Central South University》 SCIE EI CAS 2014年第11期4053-4058,共6页
The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of... The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution. 展开更多
关键词 high silicon carbide aluminum-base composites electronic packaging semi-solid thixoforming thermal conductivity coefficient of thermal expansion
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