The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is...The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.展开更多
分别从已腈和乙醚(1:1)及乙醇和乙醚(1:10)混和溶剂为介质制得了碘化钇与15-冠-5(15 C 5),18-钇-6(18 C 6)的组成为1:1(钇:冠醚)的混和物,所得配合物在高真空时稳定,置于空气中缓慢被氧化而分解。通过元素分析、摩尔电导、红外、差热-...分别从已腈和乙醚(1:1)及乙醇和乙醚(1:10)混和溶剂为介质制得了碘化钇与15-冠-5(15 C 5),18-钇-6(18 C 6)的组成为1:1(钇:冠醚)的混和物,所得配合物在高真空时稳定,置于空气中缓慢被氧化而分解。通过元素分析、摩尔电导、红外、差热-热重和X射线粉末衍射等分析该段研究了它们的有关性质,得到了一些新结果。展开更多
基金Project(06GK2002) supported by the Major Project of Hunan Provincial Science and Technology Development Strategy
文摘The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.
文摘分别从已腈和乙醚(1:1)及乙醇和乙醚(1:10)混和溶剂为介质制得了碘化钇与15-冠-5(15 C 5),18-钇-6(18 C 6)的组成为1:1(钇:冠醚)的混和物,所得配合物在高真空时稳定,置于空气中缓慢被氧化而分解。通过元素分析、摩尔电导、红外、差热-热重和X射线粉末衍射等分析该段研究了它们的有关性质,得到了一些新结果。
