Microstructure and electrical properties of La2 O3-doped ZnO-Bi2 O3 thin films prepared by sol–gel process have been investigated.X-ray diffraction shows that most diffraction peaks of ZnO are equal,and the crystals ...Microstructure and electrical properties of La2 O3-doped ZnO-Bi2 O3 thin films prepared by sol–gel process have been investigated.X-ray diffraction shows that most diffraction peaks of ZnO are equal,and the crystals of ZnO grow well.Scanning electron microscopy and atomic force microscopy results indicate that the samples have a good structure and lower surface roughness.The nonlinear V–I characteristics of the films show that La2 O3 develops the electrical properties largely and the best doped content is 0.3% lanthanum ion,with the leakage current of 0.25 mA,the threshold field of 150 V/mm and the nonlinear coefficient of 4.0 in detail.展开更多
针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟...针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟研究态密度关键参数对器件性能的影响,以此揭示a-IGZO TFTs中制备工艺对导电沟道修复的物理机理.首先,采用结合强度较高的钼/铜双层结构作为栅/源/漏电极,引入BCE方法制备了底栅顶接触(BottomGate Top-Contact,BG-TC)TFTs.其次,建立了适用于BCE技术的a-IGZO TFTs的HCD-DOS模型.随后,基于TCAD(Technology Computer Aided Design)仿真器对态密度关键参数进行数值研究,结果表明,不同态密度参数对a-IGZO TFTs器件转移特性曲线、电学特性以及沟道内部电子浓度分布的影响有所差异.最后,基于HCD-DOS模型探索SiO_(x)钝化层沉积和N_(2)O等离子体处理对器件内部机理的影响.研究发现,N2O等离子体处理对态密度分布和沟道载流子浓度有显著影响,进而导致阈值电压正向漂移.展开更多
基金Project(20123227120021)supported by the Specialized Research Fund for the Doctoral Program of Higher Education of ChinaProject(BK2012156)supported by the Natural Science Foundation of Jiangsu Province,China+3 种基金Project(KFJJ201105)supported by the Opening Project of State Key Laboratory of Electronic Thin Films and Integrated Devices,ChinaProject(CJ20125001)supported by the Application Program for Basic Research of Changzhou,ChinaProject(13KJB430006)supported by the Universities Natural Science Research project of Jiangsu Province,ChinaProject supported by the Industrial Center of Jiangsu University Undergraduate Practice-Innovation Training Program,China
文摘Microstructure and electrical properties of La2 O3-doped ZnO-Bi2 O3 thin films prepared by sol–gel process have been investigated.X-ray diffraction shows that most diffraction peaks of ZnO are equal,and the crystals of ZnO grow well.Scanning electron microscopy and atomic force microscopy results indicate that the samples have a good structure and lower surface roughness.The nonlinear V–I characteristics of the films show that La2 O3 develops the electrical properties largely and the best doped content is 0.3% lanthanum ion,with the leakage current of 0.25 mA,the threshold field of 150 V/mm and the nonlinear coefficient of 4.0 in detail.
文摘针对背沟道刻蚀(Back Channel Etch,BCE)技术的非晶铟镓锌氧化物(a-IGZO)薄膜晶体管(Thin Film Transistor,TFTs),建立了一种高浓度掺杂态密度模型(High Concentration Doping Density Of States model,HCD-DOS model),并通过数值模拟研究态密度关键参数对器件性能的影响,以此揭示a-IGZO TFTs中制备工艺对导电沟道修复的物理机理.首先,采用结合强度较高的钼/铜双层结构作为栅/源/漏电极,引入BCE方法制备了底栅顶接触(BottomGate Top-Contact,BG-TC)TFTs.其次,建立了适用于BCE技术的a-IGZO TFTs的HCD-DOS模型.随后,基于TCAD(Technology Computer Aided Design)仿真器对态密度关键参数进行数值研究,结果表明,不同态密度参数对a-IGZO TFTs器件转移特性曲线、电学特性以及沟道内部电子浓度分布的影响有所差异.最后,基于HCD-DOS模型探索SiO_(x)钝化层沉积和N_(2)O等离子体处理对器件内部机理的影响.研究发现,N2O等离子体处理对态密度分布和沟道载流子浓度有显著影响,进而导致阈值电压正向漂移.