The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of...The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.展开更多
电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与...电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。展开更多
文摘The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
文摘电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。
