The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the developme...The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m^(−1)·K^(−1),4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.展开更多
文摘The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m^(−1)·K^(−1),4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.
