The mathematical model of electromagnetic compatibility and the distribution of aircraft antenna system have been investigated. The solutions of the antenna gain and electromagnetic interference margin in the regions ...The mathematical model of electromagnetic compatibility and the distribution of aircraft antenna system have been investigated. The solutions of the antenna gain and electromagnetic interference margin in the regions of low frequency, resonance and high frequency were discussed. By using the basic analytical method of the EMI margin the distributed antenna system can be determined. The main program flow chart of distributed antenna design were given, and illustrated with examples of the microstrip antennas.展开更多
As for the Domino effect dv/dt and electromagnetic interference during the rapid switching course of single-chip switching power supply,this article firstly analyzes electromagnetic interference source,and then diagno...As for the Domino effect dv/dt and electromagnetic interference during the rapid switching course of single-chip switching power supply,this article firstly analyzes electromagnetic interference source,and then diagnoses the essential interaction relationship between interference and switching activity based on the timely and area measured waveform,analyzes and studies the production mechanism and coupling path of interference mode,and sets up circuit model according to the features of transverse mode interference and common mode interference.Put forward different suppression methods finally.展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
文摘The mathematical model of electromagnetic compatibility and the distribution of aircraft antenna system have been investigated. The solutions of the antenna gain and electromagnetic interference margin in the regions of low frequency, resonance and high frequency were discussed. By using the basic analytical method of the EMI margin the distributed antenna system can be determined. The main program flow chart of distributed antenna design were given, and illustrated with examples of the microstrip antennas.
基金Tianjin Natunal science Foundation of China(No:05YFSYSF033)
文摘As for the Domino effect dv/dt and electromagnetic interference during the rapid switching course of single-chip switching power supply,this article firstly analyzes electromagnetic interference source,and then diagnoses the essential interaction relationship between interference and switching activity based on the timely and area measured waveform,analyzes and studies the production mechanism and coupling path of interference mode,and sets up circuit model according to the features of transverse mode interference and common mode interference.Put forward different suppression methods finally.
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
