Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Mo...Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Moreover,the working grits have low protrusion heights,so the cutting speed of the tool is limited. Furthermore,the rubbing of metal matrix and the work object can cause thermal damages of diamond and other materials,and power increase for the operation. Diamond can be firmly held in a metal matrix by brazing.Because of the presence of strong chemical bonding,diamond grits can protrude twice as high without being knocked off from the matrix.As a result,the cutting speed of the tool may be doubled. When the braze melts,the carbide formers will migrate toward diamond to form carbide at the interface. This reaction may be excessive as to degrade diamond significantly.In this case,a coating on diamond may be needed to moderate the reaction. When diamond is brazed on the surface of a substrate,the melt tends to pull the grits closer together that may thicken the braze layer locally.The clustering of grits can reduce the cutting effectiveness of the diamond tool.A diamond grid design is necessary to maintain the uniform thickness of the braze layer.Moreover,the controlled melting of braze alloy can form a gentle slope around each diamond grit.Such a massive support can allow aggressive cutting of the diamond tool with a low power consumption.展开更多
Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity ...Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity is controlled by the frequency(density) of such asperities.Current diamond pad conditioners cannot dress the pad to produce microns sized asperities at high density.This is because the tips of diamond grits cannot be leveled to the same height so the grooved pad top is uneven with excessive asperities that may ruin the wafer and under sized asperities that is easily glazed. New designs of diamond pad conditioners have markedly improved the leveling of diamond tips.Organic diamond disks(ODD) are manufactured by reverse casting of polymers.Due to the uniform spacing of diamond grits and their controlled tip heights,none of the diamond grits will be overly stressed.Moreover,all diamond grits are sharing the dressing work.Consequently,the number of working grits of ODD is significantly higher than conventional designs.Moreover,because no diamond will cut pad unecessarily,the pad life is greatly lengthened.Furthermore,due to the uniform distribution of pad asperities,the slurry will be held efficiently so the run off is avoided.As a result,the slurry usage is reduced.ODD is therefore a significant savor of CMP consumables for semiconductor manufacture.展开更多
文摘Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Moreover,the working grits have low protrusion heights,so the cutting speed of the tool is limited. Furthermore,the rubbing of metal matrix and the work object can cause thermal damages of diamond and other materials,and power increase for the operation. Diamond can be firmly held in a metal matrix by brazing.Because of the presence of strong chemical bonding,diamond grits can protrude twice as high without being knocked off from the matrix.As a result,the cutting speed of the tool may be doubled. When the braze melts,the carbide formers will migrate toward diamond to form carbide at the interface. This reaction may be excessive as to degrade diamond significantly.In this case,a coating on diamond may be needed to moderate the reaction. When diamond is brazed on the surface of a substrate,the melt tends to pull the grits closer together that may thicken the braze layer locally.The clustering of grits can reduce the cutting effectiveness of the diamond tool.A diamond grid design is necessary to maintain the uniform thickness of the braze layer.Moreover,the controlled melting of braze alloy can form a gentle slope around each diamond grit.Such a massive support can allow aggressive cutting of the diamond tool with a low power consumption.
文摘Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity is controlled by the frequency(density) of such asperities.Current diamond pad conditioners cannot dress the pad to produce microns sized asperities at high density.This is because the tips of diamond grits cannot be leveled to the same height so the grooved pad top is uneven with excessive asperities that may ruin the wafer and under sized asperities that is easily glazed. New designs of diamond pad conditioners have markedly improved the leveling of diamond tips.Organic diamond disks(ODD) are manufactured by reverse casting of polymers.Due to the uniform spacing of diamond grits and their controlled tip heights,none of the diamond grits will be overly stressed.Moreover,all diamond grits are sharing the dressing work.Consequently,the number of working grits of ODD is significantly higher than conventional designs.Moreover,because no diamond will cut pad unecessarily,the pad life is greatly lengthened.Furthermore,due to the uniform distribution of pad asperities,the slurry will be held efficiently so the run off is avoided.As a result,the slurry usage is reduced.ODD is therefore a significant savor of CMP consumables for semiconductor manufacture.
