Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been c...Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.展开更多
We experimentally investigate Coulomb exploded directional double ionization of N2O molecules in elliptically polarized femtosecond laser pulses.The denitrogenation and deoxygenation channels are accessed via various ...We experimentally investigate Coulomb exploded directional double ionization of N2O molecules in elliptically polarized femtosecond laser pulses.The denitrogenation and deoxygenation channels are accessed via various pathways.It leads to distinct asymmetries in directional breaking of the doubly ionized N2O molecules versus the instantaneous laser field vector, which is revealed by tracing the sum-momentum spectra of the ionic fragments as a recoil of the ejected electrons.Our results demonstrate that the accessibility of the Coulomb exploded double ionization channels of N2O molecules are ruled by the detailed potential energy curves, and the directional emission of the fragments are governed by the joint effects of the electron localization-assisted enhanced ionization of the stretched molecules and the profiles of the molecular orbitals.展开更多
利用扫描电镜、聚焦离子束、强度测试仪研究了键合铜线无卤直接镀钯工艺及不同模具孔径对镀钯键合铜线表面质量、镀层厚度的影响规律,分析了钯层均匀性对键合性能的影响机理.研究结果表明：无卤直接镀钯工艺可获得镀层均匀的镀钯键合铜...利用扫描电镜、聚焦离子束、强度测试仪研究了键合铜线无卤直接镀钯工艺及不同模具孔径对镀钯键合铜线表面质量、镀层厚度的影响规律,分析了钯层均匀性对键合性能的影响机理.研究结果表明：无卤直接镀钯工艺可获得镀层均匀的镀钯键合铜线;直接镀模具孔径大于被镀铜线直径3～4μm时,镀钯铜线镀层均匀且表面光洁;镀钯铜线钯层不均匀会造成Electronic-Flame-Off（EFO）过程中的Free Air Ball（FAB）偏球缺陷,进而降低焊点力学性能;直接镀钯键合铜线镀层均匀,避免了Free Air Ball（FAB）偏球缺陷,焊点球剪切力≥15 g、球拉力≥8 g,呈非离散分布,满足工业化要求.展开更多
基金the National Key R&D Program of China(Grant No.2019YFB1704600)the Hubei Provincial Natural Science Foundation of China(Grant No.2020CFA032).
文摘Currently,wire bonding is the most popular first-level interconnection technology used between the die and package terminals,but even with its long-term and excessive usage,the mechanism of wire bonding has not been completely evaluated.Therefore,fundamental research is still needed.In this study,the mechanism of microweld formation and breakage during Cu-Cu wire bonding was investigated by using molecular dynamics simulation.The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate.Elastic contact and plastic instability were investigated through the loading and unloading processes.Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated.It was shown that the loading and unloading curves do not coincide,and the unloading curve exhibited hysteresis.For the substrate,in the loading process,the main force changed from attractive to repulsive.The maximum von Mises stress increased and shifted from the center toward the edge of the contact area.During the unloading process,the main force changed from repulsive to attractive.The Mises stress reduced first and then increased.Stress concentration occurs around dislocations in the middle area of the Cu wire.
基金Project supported by the National Key R&D Program of China(Grant No.2018YFA0306303)the National Natural Science Fundation of China(Grant Nos.11425416,11834004,and 11761141004)the 111 Project of China(Grant No.B12024)
文摘We experimentally investigate Coulomb exploded directional double ionization of N2O molecules in elliptically polarized femtosecond laser pulses.The denitrogenation and deoxygenation channels are accessed via various pathways.It leads to distinct asymmetries in directional breaking of the doubly ionized N2O molecules versus the instantaneous laser field vector, which is revealed by tracing the sum-momentum spectra of the ionic fragments as a recoil of the ejected electrons.Our results demonstrate that the accessibility of the Coulomb exploded double ionization channels of N2O molecules are ruled by the detailed potential energy curves, and the directional emission of the fragments are governed by the joint effects of the electron localization-assisted enhanced ionization of the stretched molecules and the profiles of the molecular orbitals.
文摘利用扫描电镜、聚焦离子束、强度测试仪研究了键合铜线无卤直接镀钯工艺及不同模具孔径对镀钯键合铜线表面质量、镀层厚度的影响规律,分析了钯层均匀性对键合性能的影响机理.研究结果表明：无卤直接镀钯工艺可获得镀层均匀的镀钯键合铜线;直接镀模具孔径大于被镀铜线直径3～4μm时,镀钯铜线镀层均匀且表面光洁;镀钯铜线钯层不均匀会造成Electronic-Flame-Off（EFO）过程中的Free Air Ball（FAB）偏球缺陷,进而降低焊点力学性能;直接镀钯键合铜线镀层均匀,避免了Free Air Ball（FAB）偏球缺陷,焊点球剪切力≥15 g、球拉力≥8 g,呈非离散分布,满足工业化要求.
