期刊文献+
共找到2,854篇文章
< 1 2 143 >
每页显示 20 50 100
Test system of the front-end readout for an application-specific integrated circuit for the water Cherenkov detector array at the large high-altitude air shower observatory 被引量:5
1
作者 Er-Lei Chen Lei Zhao +4 位作者 Li Yu Jia-Jun Qin Yu Liang Shu-Bin Liu Qi An 《Nuclear Science and Techniques》 SCIE CAS CSCD 2017年第6期140-149,共10页
The water Cherenkov detector array(WCDA) is an important part of the large high-altitude air shower observatory(LHAASO),which is in a research and development phase.The central scientific goal of LHAASO is to explore ... The water Cherenkov detector array(WCDA) is an important part of the large high-altitude air shower observatory(LHAASO),which is in a research and development phase.The central scientific goal of LHAASO is to explore the origin of high-energy cosmic rays of the universe and to push forward the frontier of new physics.To simplify the WCDA's readout electronics,a prototype of a front-end readout for an application-specific integrated circuit(ASIC) is designed based on the timeover-threshold method to achieve charge-to-time conversion.High-precision time measurement and charge measurement are necessary over a full dynamic range[1-4000photoelectrons(P.E.)].To evaluate the performance of this ASIC,a test system is designed that includes the front-end ASIC test module,digitization module,and test software.The first module needs to be customized for different ASIC versions,whereas the digitization module and test software are tested for general-purpose use.In the digitization module,a field programmable gate array-based time-todigital converter is designed with a bin size of 333 ps,which also integrates an inter-integrated circuit to configure the ASIC test module,and a universal serial bus interface is designed to transfer data to the remote computer.Test results indicate that the time resolution is better than 0.5 ns,and the charge resolution is better than 30%root mean square(RMS) at 1 P.E.and 3%RMS at 4000 P.E.,which are beyond the application requirements. 展开更多
关键词 Time and charge measurement PHOTOMULTIPLIER tube (PMT) Water CHERENKOV detector ARRAY Inter-integrated circuit Application-specific integrated circuit Test system
在线阅读 下载PDF
Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits 被引量:3
2
作者 钱利波 朱樟明 +2 位作者 夏银水 丁瑞雪 杨银堂 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第3期591-596,共6页
Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical ... Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 rnV and 379 mV reductions in the peak noise voltage, respectively. 展开更多
关键词 three-dimensional integrated circuits through-silicon-via crosstalk driver sizing via shielding
在线阅读 下载PDF
High density Al2O3/TaN-based metal-insulatormetal capacitors in application to radio equency integrated circuits 被引量:3
3
作者 丁士进 黄宇健 +3 位作者 黄玥 潘少辉 张卫 汪礼康 《Chinese Physics B》 SCIE EI CAS CSCD 2007年第9期2803-2808,共6页
Metal-insulator-metal (MIM) capacitors with atomic-layer-deposited Al2O3 dielectric and reactively sputtered TaN electrodes in application to radio frequency integrated circuits have been characterized electrically.... Metal-insulator-metal (MIM) capacitors with atomic-layer-deposited Al2O3 dielectric and reactively sputtered TaN electrodes in application to radio frequency integrated circuits have been characterized electrically. The capacitors exhibit a high density of about 6.05 fF/μm^2, a small leakage current of 4.8 × 10^-8 A/cm^2 at 3 V, a high breakdown electric field of 8.61 MV/cm as well as acceptable voltage coefficients of capacitance (VCCs) of 795 ppm/V2 and 268ppm/V at 1 MHz. The observed properties should be attributed to high-quality Al2O3 film and chemically stable TaN electrodes. Further, a logarithmically linear relationship between quadratic VCC and frequency is observed due to the change of relaxation time with carrier mobility in the dielectric. The conduction mechanism in the high field ranges is dominated by the Poole-Frenkel emission, and the leakage current in the low field ranges is likely to be associated with trap-assisted tunnelling. Meanwhile, the Al2O3 dielectric presents charge trapping under low voltage stresses, and defect generation under high voltage stresses, and it has a hard-breakdown performance. 展开更多
关键词 metal-insulator-metal atomic-layer-deposition AL2O3 radio frequency integrated circuit
在线阅读 下载PDF
Emerging MoS_(2)Wafer-Scale Technique for Integrated Circuits 被引量:6
4
作者 Zimeng Ye Chao Tan +4 位作者 Xiaolei Huang Yi Ouyang Lei Yang Zegao Wang Mingdong Dong 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第3期129-170,共42页
As an outstanding representative of layered materials,molybdenum disulfide(MoS_(2))has excellent physical properties,such as high carrier mobility,stability,and abundance on earth.Moreover,its reasonable band gap and ... As an outstanding representative of layered materials,molybdenum disulfide(MoS_(2))has excellent physical properties,such as high carrier mobility,stability,and abundance on earth.Moreover,its reasonable band gap and microelectronic compatible fabrication characteristics makes it the most promising candidate in future advanced integrated circuits such as logical electronics,flexible electronics,and focal-plane photodetector.However,to realize the all-aspects application of MoS_(2),the research on obtaining high-quality and large-area films need to be continuously explored to promote its industrialization.Although the MoS_(2)grain size has already improved from several micrometers to sub-millimeters,the high-quality growth of wafer-scale MoS_(2)is still of great challenge.Herein,this review mainly focuses on the evolution of MoS_(2)by including chemical vapor deposition,metal–organic chemical vapor deposition,physical vapor deposition,and thermal conversion technology methods.The state-of-the-art research on the growth and optimization mechanism,including nucleation,orientation,grain,and defect engineering,is systematically summarized.Then,this review summarizes the wafer-scale application of MoS_(2)in a transistor,inverter,electronics,and photodetectors.Finally,the current challenges and future perspectives are outlined for the wafer-scale growth and application of MoS_(2). 展开更多
关键词 Wafer-scale growth Molybdenum disulfide Gas deposition integrated circuits
在线阅读 下载PDF
High performance integrated photonic circuit based on inverse design method 被引量:6
5
作者 Huixin Qi Zhuochen Du +3 位作者 Xiaoyong Hu Jiayu Yang Saisai Chu Qihuang Gong 《Opto-Electronic Advances》 SCIE EI CAS 2022年第10期22-34,共13页
The basic indexes of all-optical integrated photonic circuits include high-density integration,ultrafast response and ultralow energy consumption.Traditional methods mainly adopt conventional micro/nano-structures.The... The basic indexes of all-optical integrated photonic circuits include high-density integration,ultrafast response and ultralow energy consumption.Traditional methods mainly adopt conventional micro/nano-structures.The overall size of the circuit is large,usually reaches hundreds of microns.Besides,it is difficult to balance the ultrafast response and ultra-low energy consumption problem,and the crosstalk between two traditional devices is difficult to overcome.Here,we propose and experimentally demonstrate an approach based on inverse design method to realize a high-density,ultrafast and ultra-low energy consumption integrated photonic circuit with two all-optical switches controlling the input states of an all-optical XOR logic gate.The feature size of the whole circuit is only 2.5μm×7μm,and that of a single device is 2μm×2μm.The distance between two adjacent devices is as small as 1.5μm,within wavelength magnitude scale.Theoretical response time of the circuit is 150 fs,and the threshold energy is within 10 fJ/bit.We have also considered the crosstalk problem.The circuit also realizes a function of identifying two-digit logic signal results.Our work provides a new idea for the design of ultrafast,ultra-low energy consumption all-optical devices and the implementation of high-density photonic integrated circuits. 展开更多
关键词 all-optical integrated photonic circuit inverse design all-optical switch all-optical XOR logic gate
在线阅读 下载PDF
A 330-500 GHz Zero-Biased Broadband Tripler Based on Terahertz Monolithic Integrated Circuits 被引量:3
6
作者 任田昊 张勇 +4 位作者 延波 徐锐敏 杨成樾 周静涛 金智 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第2期31-34,共4页
A 330-500 GHz zero-biased broadband monolithic integrated tripler is reported. The measured results show that the maximum efficiency and the maximum output power are 2% and 194μW at 348 GHz. The saturation characteri... A 330-500 GHz zero-biased broadband monolithic integrated tripler is reported. The measured results show that the maximum efficiency and the maximum output power are 2% and 194μW at 348 GHz. The saturation characteristic test shows that the output i dB compression point is about -8.5 dBm at 334 GHz and the maximum efficiency is obtained at the point, which is slightly below the 1 dB compression point. Compared with the conventional hybrid integrated circuit, a major advantage of the monolithic integrated circuit is the significant improvement of reliability and consistency. In this work, a terahertz monolithic frequency multiplier at this band is designed and fabricated. 展开更多
关键词 InP InGaAs A 330-500 GHz Zero-Biased Broadband Tripler Based on Terahertz Monolithic integrated circuits dBm SBD
在线阅读 下载PDF
Concise Modeling of Amorphous Dual-Gate In-Ga-Zn-O Thin-Film Transistors for Integrated Circuit Designs 被引量:1
7
作者 Can Li Cong-Wei Liao +3 位作者 Tian-Bao Yu Jian-Yuan Ke Sheng-Xiang Huang Lian-Wen Deng 《Chinese Physics Letters》 SCIE CAS CSCD 2018年第2期93-96,共4页
An analytical model for current-voltage behavior of amorphous In-Ga-Zn-O thin-film transistors(a-IGZO TFTs)with dual-gate structures is developed.The unified expressions for synchronous and asynchronous operating mo... An analytical model for current-voltage behavior of amorphous In-Ga-Zn-O thin-film transistors(a-IGZO TFTs)with dual-gate structures is developed.The unified expressions for synchronous and asynchronous operating modes are derived on the basis of channel charges,which are controlled by gate voltage.It is proven that the threshold voltage of asynchronous dual-gate IGZO TFTs is adjusted in proportion to the ratio of top insulating capacitance to the bottom insulating capacitance(C_(TI)/C_(BI)).Incorporating the proposed model with Verilog-A,a touch-sensing circuit using dual-gate structure is investigated by SPICE simulations.Comparison shows that the touch sensitivity is increased by the dual-gate IGZO TFT structure. 展开更多
关键词 TFT Concise Modeling of Amorphous Dual-Gate In-Ga-Zn-O Thin-Film Transistors for integrated circuit Designs Zn
在线阅读 下载PDF
Influence of Tilted Angle on Effective Linear Energy Transfer in Single Event Effect Tests for Integrated Circuits at 130 nm Technology Node 被引量:2
8
作者 张乐情 卢健 +5 位作者 胥佳灵 刘小年 戴丽华 徐依然 毕大炜 张正选 《Chinese Physics Letters》 SCIE CAS CSCD 2017年第11期119-122,共4页
A heavy-ion irradiation experiment is studied in digital storage cells with different design approaches in 130?nm CMOS bulk Si and silicon-on-insulator (SOI) technologies. The effectiveness of linear energy transf... A heavy-ion irradiation experiment is studied in digital storage cells with different design approaches in 130?nm CMOS bulk Si and silicon-on-insulator (SOI) technologies. The effectiveness of linear energy transfer (LET) with a tilted ion beam at the 130?nm technology node is obtained. Tests of tilted angles θ=0 ° , 30 ° and 60 ° with respect to the normal direction are performed under heavy-ion Kr with certain power whose LET is about 40?MeVcm 2 /mg at normal incidence. Error numbers in D flip-flop chains are used to determine their upset sensitivity at different incidence angles. It is indicated that the effective LETs for SOI and bulk Si are not exactly in inverse proportion to cosθ , furthermore the effective LET for SOI is more closely in inverse proportion to cosθ compared to bulk Si, which are also the well known behavior. It is interesting that, if we design the sample in the dual interlocked storage cell approach, the effective LET in bulk Si will look like inversely proportional to cosθ very well, which is also specifically explained. 展开更多
关键词 SOI Influence of Tilted Angle on Effective Linear Energy Transfer in Single Event Effect Tests for integrated circuits at 130 nm Tec
在线阅读 下载PDF
Digital synthesis of programmable photonic integrated circuits
9
作者 Juan Zhang Zhengyong Ji +1 位作者 Yipeng Ding Yang Wang 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第2期355-365,共11页
Programmable photonic waveguide meshes can be programmed into many different circuit topologies and thereby provide a variety of functions.Due to the complexity of the signal routing in a general mesh,a particular syn... Programmable photonic waveguide meshes can be programmed into many different circuit topologies and thereby provide a variety of functions.Due to the complexity of the signal routing in a general mesh,a particular synthesis algorithm often only accounts for a specific function with a specific cell configuration.In this paper,we try to synthesize the programmable waveguide mesh to support multiple configurations with a more general digital signal processing platform.To show the feasibility of this technique,photonic waveguide meshes in different configurations(square,triangular and hexagonal meshes)are designed to realize optical signal interleaving with arbitrary duty cycles.The digital signal processing(DSP)approach offers an effective pathway for the establishment of a general design platform for the software-defined programmable photonic integrated circuits.The use of well-developed DSP techniques and algorithms establishes a link between optical and electrical signals and makes it convenient to realize the computer-aided design of optics–electronics hybrid systems. 展开更多
关键词 photonic integrated circuit digital signal processing Z-TRANSFORM
在线阅读 下载PDF
Creating Distinctive Connections between Multifunctional Microwave Circuits and Mobile-Terminal Radio-Frequency Integrated Chips Using Integrated Passive Device Technology
10
作者 Yongle Wu Mengdan Kong +1 位作者 Zheng Zhuang Weimin Wang 《China Communications》 SCIE CSCD 2021年第8期121-132,共12页
In this review,the advanced microwave devices based on the integrated passive device(IPD)technology are expounded and discussed in detail,involving the performance breakthroughs and circuit innovations.Then,the develo... In this review,the advanced microwave devices based on the integrated passive device(IPD)technology are expounded and discussed in detail,involving the performance breakthroughs and circuit innovations.Then,the development trend of IPD-based multifunctional microwave circuits is predicted further by analyzing the current research hot spots.This paper discusses a distinctive research area for microwave circuits and mobile-terminal radio-frequency integrated chips. 展开更多
关键词 CHIPS integrated passive device(IPD) MULTIFUNCTIONAL microwave circuit
在线阅读 下载PDF
Microwave Integrated Circuit Design Handbook
11
作者 顾墨琳 《微波学报》 1987年第3期43-43,共1页
作者:Reinmut K.Hoffmann(1984 IEEE微波奖获得者) 出版:Artech House公司(美国)1987年本书给出适于微波工程师和研究人员应用的有关MIC方面的基础技术、电性能和设计。侧重于电性能分析和设计,强调应用。对于每一种设计技术和应用均作... 作者:Reinmut K.Hoffmann(1984 IEEE微波奖获得者) 出版:Artech House公司(美国)1987年本书给出适于微波工程师和研究人员应用的有关MIC方面的基础技术、电性能和设计。侧重于电性能分析和设计,强调应用。对于每一种设计技术和应用均作出较清楚的叙述和完整的处理。本书尽量给出电路的物理描述,避免过于冗长的数学公式,内容包含对下列议题的详细评述与研讨: 展开更多
关键词 微带传输线 微带线 Microwave integrated circuit Design Handbook
在线阅读 下载PDF
Advances in Developing Transitions in Microwave Integrated Circuits
12
作者 张运传 王秉中 《Journal of Electronic Science and Technology of China》 2005年第1期40-44,共5页
Advances in developing transitions in microwave integrated circuits during the last ten years are reviewed. Some typical structures of transition are introduced. Transition structures can be classified into two basic ... Advances in developing transitions in microwave integrated circuits during the last ten years are reviewed. Some typical structures of transition are introduced. Transition structures can be classified into two basic types: one is transition between the same kind of transmission lines on different planes of a common substrate, the other transition between different types of transmission lines. Furthermore, future development of transition structures is discussed. 展开更多
关键词 ADVANCE transition structure microwave integrated circuits transmission line
在线阅读 下载PDF
A versatile 16-channel front-end integrated circuit for semiconductor radiation detectors
13
作者 ZHANG Yacong CHEN Zhongjian +3 位作者 LU Wengao AN Huiyao JIN Ye JI Lijiu 《Nuclear Science and Techniques》 SCIE CAS CSCD 2010年第2期118-122,共5页
A CMOS front-end integrated circuit consisting of 16 identical analog channels is proposed for semiconductor radiation detectors. Each of the 16 channels has a low noise charge sensitive amplifier, a pulse shaper, a p... A CMOS front-end integrated circuit consisting of 16 identical analog channels is proposed for semiconductor radiation detectors. Each of the 16 channels has a low noise charge sensitive amplifier, a pulse shaper, a peak detect and hold circuit and a discriminator, while analog voltage and channel address are routed off the chip. It can accommodate both electron and hole collection with selectable gain and peaking time. Sequential and sparse readout, combining with self-trigger and external trigger, makes four readout modes. The circuit is implemented in a 0.35 μm DP4M (double-poly-quad-metal) CMOS technology with an area of 2.5×1.54 mm2 and power dissipation of 60 mW. A single channel chip is tested with Verigy 93000. The gain is adjustable from 13 to 130 mV·fC–1 while the peaking time varies between 0.7 and 1.6 μs. The linearity is more than 99% and the equivalent noise charge is about 600e. 展开更多
关键词 辐射探测器 集成电路 16通道 半导体 前端 电荷灵敏放大器 CMOS技术 模拟通道
在线阅读 下载PDF
Ultra-Low Linewidth Frequency Stabilized Integrated Lasers: A New Frontier in Integrated Photonics
14
作者 GU Zhenqian YANG Zhen +3 位作者 ZHA Lulu HU Junhui CHI Nan SHEN Chao 《ZTE Communications》 2024年第4期29-39,共11页
With the advancement of photonic integration technology,ultra-low linewidth frequency-stabilized lasers have demonstrated significant potential in precision measurement,quantum communication,atomic clocks,etc.This rev... With the advancement of photonic integration technology,ultra-low linewidth frequency-stabilized lasers have demonstrated significant potential in precision measurement,quantum communication,atomic clocks,etc.This review summarizes the latest developments in integrated photonics for achieving ultra-low linewidth lasers,particularly breakthroughs made by integrating Brillouin lasers.We discuss the design principles,manufacturing processes,performance characteristics,and potential value of these lasers in various applications. 展开更多
关键词 photonic integrated circuit(PIC) ultra-low linewidth Brillouin lasers high Q-factor
在线阅读 下载PDF
微型高集成可压缩电缆组件设计制造及互联阵列实施
15
作者 周三三 朱建军 +1 位作者 曹志伟 苏扬 《现代雷达》 北大核心 2025年第3期58-61,共4页
机载雷达综合层的层间空间狭小,层内器件布局密集,实现有限空间各模块、元器件间的互联互通结构复杂,装配工艺难度高。常规的导线对接方式如分线环转接、焊锡环对接、U型搭接等的对接区域约30 mm,无法满足高集成空间内电信号的多点互联... 机载雷达综合层的层间空间狭小,层内器件布局密集,实现有限空间各模块、元器件间的互联互通结构复杂,装配工艺难度高。常规的导线对接方式如分线环转接、焊锡环对接、U型搭接等的对接区域约30 mm,无法满足高集成空间内电信号的多点互联。文中提出一种基于嵌入微型电路板的微型高集成可压缩、互联阵列的电缆组件的转接方式,创新性地将微型电路板引入电缆组件中,由微型电路板作为转接媒介实现电缆组件的多孔位转接,同时将电缆组件的导线束预成型使电连接器头部可浮动伸缩,实现了可压缩功能,通过多个电缆组件组合可实现互联阵列,解决了低矮空间内的高可靠性电信号转接与机载雷达综合层间的高密度、高集成的电缆互联的难题。 展开更多
关键词 微型电缆组件 高集成 可压缩 微型电路板 互联阵列
在线阅读 下载PDF
面向双频DC-DC变换器的EIE型磁集成电感器设计
16
作者 高圣伟 金从众 +1 位作者 于冠恒 王玺然 《天津工业大学学报》 北大核心 2025年第1期75-82,90,共9页
为提高双频DC-DC变换器的功率密度,提出一种将独立的高低频电感集成在一个EIE型磁芯上的磁集成电感器设计方案,通过建立集成磁件的电路-磁路等效模型,设计了双频DC-DC变换器的EIE型磁集成电感器的结构,建立了集成电感的等效模型,对磁集... 为提高双频DC-DC变换器的功率密度,提出一种将独立的高低频电感集成在一个EIE型磁芯上的磁集成电感器设计方案,通过建立集成磁件的电路-磁路等效模型,设计了双频DC-DC变换器的EIE型磁集成电感器的结构,建立了集成电感的等效模型,对磁集成双频DC-DC变换器进行了仿真分析,并通过实验平台验证了新型磁件的运行效果。结果表明:新型磁件设计合理,可以在系统中稳定运行,通过测量得到集成磁元件的体积和质量分别为原来的27.6%和23.3%,使得双频变换器系统的功率密度得到了提升。 展开更多
关键词 EIE型集成电感器 磁集成技术 双频DC-DC变换器 磁路等效模型
在线阅读 下载PDF
基于可重配置环形振荡器的TSV诊断方法
17
作者 陈田 章云飞 +4 位作者 刘军 鲁迎春 吴大平 陈炜坤 邵宇寒 《微电子学与计算机》 2025年第3期92-99,共8页
硅通孔(Through Silicon Via,TSV)是堆叠形成三维芯片(Three-Dimensional Chips,3D ICs)的关键部件,因此在制造过程中检测出TSV故障是十分重要的。目前的测试方法存在测试成本较高、难以使用同一结构对TSV键合的全过程进行测试以及无法... 硅通孔(Through Silicon Via,TSV)是堆叠形成三维芯片(Three-Dimensional Chips,3D ICs)的关键部件,因此在制造过程中检测出TSV故障是十分重要的。目前的测试方法存在测试成本较高、难以使用同一结构对TSV键合的全过程进行测试以及无法分辨TSV故障的类型等问题。为此,提出了一种基于可重配置的环形振荡器结构的TSV检测方法。该方法能够在TSV制造的各个阶段同时测试多个TSV,并且根据键合前和键合后振荡周期的变化,判断TSV故障的类型,定位发生故障的TSV。HSPICE的仿真结果表明,所提结构可以有效检测并定位TSV各阶段的故障。 展开更多
关键词 三维集成电路 硅通孔 环形振荡器
在线阅读 下载PDF
基于语义加权网络的重点领域科学基金资助态势识别研究
18
作者 王伟 梁继文 杨建林 《现代情报》 北大核心 2025年第1期46-59,111,共15页
[目的/意义]科学基金制度是各国(地区)提升科学研究水平的重要方式,准确识别科学基金的资助方向和资助成效是感知科技发展态势的关键。[方法/过程]为识别科学基金资助态势,在提出关键短语抽取规则后,利用语义相似度消除同、近义词的歧... [目的/意义]科学基金制度是各国(地区)提升科学研究水平的重要方式,准确识别科学基金的资助方向和资助成效是感知科技发展态势的关键。[方法/过程]为识别科学基金资助态势,在提出关键短语抽取规则后,利用语义相似度消除同、近义词的歧义影响,利用动态滑动窗口和语义相似度构建语义加权的词共现网络,并基于社团划分方法识别基金主题。在集成电路领域比较1812项中国国家自然科学基金和2807项美国国家科学基金的资助主题分布、资助力度变化和资助效果,该方法能够准确识别基金主题分布和资助成效。[结果/结论]中国国家自然科学基金和美国国家科学基金均涵盖了集成电路领域的主要研究主题,在重点资助方向和资助力度上有较大差异;中国国家自然科学基金资助的论文平均被引频次相对较低,受资助机构相对单一。 展开更多
关键词 科学基金 资助态势 社团划分 词共现网络 主题分析 集成电路
在线阅读 下载PDF
线性APD焦平面多模式读出电路设计
19
作者 郑方舟 陈虓 +2 位作者 吴圣娟 申乐 李敏 《红外技术》 北大核心 2025年第3期281-288,共8页
线性雪崩光电二极管(Avalanche photodiode,APD)焦平面红外探测器有着广泛应用场景,APD探测器耦合具有多种模式的读出电路可在有限像元面积内实现多模式探测,提升探测系统集成度。本文设计了一种具有红外热成像模式、门控3D成像模式、... 线性雪崩光电二极管(Avalanche photodiode,APD)焦平面红外探测器有着广泛应用场景,APD探测器耦合具有多种模式的读出电路可在有限像元面积内实现多模式探测,提升探测系统集成度。本文设计了一种具有红外热成像模式、门控3D成像模式、激光测距模式和异步激光脉冲探测模式的APD读出电路,四种模式复用输入级电路。通过Krummenacher结构抑制背景辐射影响,扩展了光子飞行时间探测范围;提出一种改进型时刻鉴别电路,通过减小时刻鉴别误差提升距离测量精度。读出电路采用0.18μm 3.3 V CMOS工艺设计,阵列规模128×128、像元中心距30μm,最大电荷容量3.74 Me^(-)。仿真结果表明,激光测距模式,在积分电容13 f F、背景电流1~150 nA条件下,背景电流响应幅值≤1.35 m V,远小于激光响应电流500 nA时280 m V的响应幅值;异步激光脉冲探测模式的幅值灵敏度约110 nA、脉宽灵敏度约4 ns;改进型时刻鉴别电路对于150~500 nA的激光脉冲响应,时刻鉴别误差约4 ns。本文设计的多模式复用APD读出电路具有一定工程应用价值。 展开更多
关键词 线性APD 多模式读出电路 光子飞行时间 时刻鉴别误差
在线阅读 下载PDF
运放失调电压的激光修调测试
20
作者 李灿 程法勇 +2 位作者 郭晓宇 王建超 韩先虎 《现代电子技术》 北大核心 2025年第6期113-117,共5页
目前高精度运算放大器的应用愈发普及,由于集成电路制造工艺的限制,运算放大器的输入级晶体管和负载电阻无法做到完全匹配,因此需要通过修调方式提高运放输入级的匹配度,以此减小失调电压。文中介绍了运放失调电压的定义和产生的原因,... 目前高精度运算放大器的应用愈发普及,由于集成电路制造工艺的限制,运算放大器的输入级晶体管和负载电阻无法做到完全匹配,因此需要通过修调方式提高运放输入级的匹配度,以此减小失调电压。文中介绍了运放失调电压的定义和产生的原因,分析了失调电压的测试方法,并对常用的失调电压修调方法进行了介绍和对比,总结了激光修调的优点。然后分析失调电压激光修调的原理,同时基于激光修调常用的几种切割方式,选择帽型电阻双线切割方式。为了达到更高的精度和良品率,提出了一种在线激光修调方法,最终通过测试数据对比分析,验证了在线激光修调的优越性。 展开更多
关键词 运算放大器 失调电压 激光修调 自动测试系统 集成电路 制造工艺
在线阅读 下载PDF
上一页 1 2 143 下一页 到第
使用帮助 返回顶部