The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu n...The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu nanoparticles on the interface strength and failure behavior of the Ag-SnO_(2) contact materials are investigated by numerical simulations and experiments.Three-dimensional representative volume element(RVE)models for the Ag-SnO_(2) materials without and with Cu nanoparticles are established,and the cohesive zone model is used to simulate the interface debonding process.The results show that the stress−strain relationships and failure modes predicted by the simulation agree well with the experimental ones.The adhesion strengths of the Ag/SnO_(2) and Ag/Cu interfaces are respectively predicted to be 100 and 450 MPa through the inverse method.It is found that the stress concentration around the SnO_(2) phase is the primary reason for the interface debonding,which leads to the failure of Ag-SnO_(2) contact material.The addition of Cu particles not only improves the interface strength,but also effectively suppresses the initiation and propagation of cracks.The results have an reference value for improving the processability of Ag based contact materials.展开更多
系统研究了Ag Sn In Ni合金内氧化法制备Ag-Sn O_(2)-In_(2)O_(3)-Ni O电接触材料的微观组织演变机理及氧化物颗粒分布的调控。结果表明,退火工艺决定了Ag Sn In Ni的缺陷状态,随退火温度的升高,合金中缺陷密度降低,内氧化速度减慢。内...系统研究了Ag Sn In Ni合金内氧化法制备Ag-Sn O_(2)-In_(2)O_(3)-Ni O电接触材料的微观组织演变机理及氧化物颗粒分布的调控。结果表明,退火工艺决定了Ag Sn In Ni的缺陷状态,随退火温度的升高,合金中缺陷密度降低,内氧化速度减慢。内氧化过程中银合金同时发生回复与再结晶,但内氧化形成的Sn O_(2)和In_(2)O_(3)颗粒可钉扎位错、亚晶界等缺陷,抑制再结晶的发生。Ag-Sn O_(2)-In_(2)O_(3)-Ni O合金微观组织的差异是O原子沿着缺陷向样品内部扩散与Ag合金基体发生再结晶的相互竞争的结果,这导致了芯部组织为氧化物密度较低的颗粒状分布,而外侧组织为氧化物颗粒沿着缺陷墙呈现束装聚集分布。退火工艺为550℃/2 h、氧化工艺为700℃/0.3 MPa×26 h时,可获得氧化物尺寸和分布一致性高的Ag-Sn O_(2)-In_(2)O_(3)-Ni O材料。展开更多
基金Projects(11872257,11572358)supported by the National Natural Science Foundation of ChinaProject(ZD2018075)supported by the Hebei Provincial Education Department,China。
文摘The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu nanoparticles on the interface strength and failure behavior of the Ag-SnO_(2) contact materials are investigated by numerical simulations and experiments.Three-dimensional representative volume element(RVE)models for the Ag-SnO_(2) materials without and with Cu nanoparticles are established,and the cohesive zone model is used to simulate the interface debonding process.The results show that the stress−strain relationships and failure modes predicted by the simulation agree well with the experimental ones.The adhesion strengths of the Ag/SnO_(2) and Ag/Cu interfaces are respectively predicted to be 100 and 450 MPa through the inverse method.It is found that the stress concentration around the SnO_(2) phase is the primary reason for the interface debonding,which leads to the failure of Ag-SnO_(2) contact material.The addition of Cu particles not only improves the interface strength,but also effectively suppresses the initiation and propagation of cracks.The results have an reference value for improving the processability of Ag based contact materials.
文摘系统研究了Ag Sn In Ni合金内氧化法制备Ag-Sn O_(2)-In_(2)O_(3)-Ni O电接触材料的微观组织演变机理及氧化物颗粒分布的调控。结果表明,退火工艺决定了Ag Sn In Ni的缺陷状态,随退火温度的升高,合金中缺陷密度降低,内氧化速度减慢。内氧化过程中银合金同时发生回复与再结晶,但内氧化形成的Sn O_(2)和In_(2)O_(3)颗粒可钉扎位错、亚晶界等缺陷,抑制再结晶的发生。Ag-Sn O_(2)-In_(2)O_(3)-Ni O合金微观组织的差异是O原子沿着缺陷向样品内部扩散与Ag合金基体发生再结晶的相互竞争的结果,这导致了芯部组织为氧化物密度较低的颗粒状分布,而外侧组织为氧化物颗粒沿着缺陷墙呈现束装聚集分布。退火工艺为550℃/2 h、氧化工艺为700℃/0.3 MPa×26 h时,可获得氧化物尺寸和分布一致性高的Ag-Sn O_(2)-In_(2)O_(3)-Ni O材料。
