Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(I...Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.展开更多
With the wide applications of sensor network technology in traffic information acquisition systems,a new measure will be quite necessary to evaluate spatially related properties of traffic information credibility.The ...With the wide applications of sensor network technology in traffic information acquisition systems,a new measure will be quite necessary to evaluate spatially related properties of traffic information credibility.The heterogeneity of spatial distribution of information credibility from sensor networks is analyzed and a new measure,information credibility function(ICF),is proposed to describe this heterogeneity.Three possible functional forms of sensor ICF and their corresponding expressions are presented.Then,two feasible operations of spatial superposition of sensor ICFs are discussed.Finally,a numerical example is introduced to show the calibration method of sensor ICF and obtain the spatially related properties of expressway in Beijing.The results show that the sensor ICF of expressway in Beijing possesses a negative exponent property.The traffic information is more abundant at or near the locations of sensor,while with the distance away from the sensor increasing,the traffic information credibility will be declined by an exponential trend.The new measure provides theoretical bases for the optimal locations of traffic sensor networks and the mechanism research of spatial distribution of traffic information credibility.展开更多
基金Project(U2341254)supported by Ye Qisun Science Foundation of National Natural Science Foundation of ChinaProject(52475406)supported by the National Nature Science Foundation of ChinaProject(2024CY2-GJHX-32)supported by the Key R&D Program of Shaanxi Province,China。
文摘Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.
基金Project(61104164)supported by the National Natural Science Foundation of ChinaProject(2012AA112401)supported by the National High Technology Research and Development Program of ChinaProject(2012YJS059)supported by the Fundamental Research Funds for the Central Universities of China
文摘With the wide applications of sensor network technology in traffic information acquisition systems,a new measure will be quite necessary to evaluate spatially related properties of traffic information credibility.The heterogeneity of spatial distribution of information credibility from sensor networks is analyzed and a new measure,information credibility function(ICF),is proposed to describe this heterogeneity.Three possible functional forms of sensor ICF and their corresponding expressions are presented.Then,two feasible operations of spatial superposition of sensor ICFs are discussed.Finally,a numerical example is introduced to show the calibration method of sensor ICF and obtain the spatially related properties of expressway in Beijing.The results show that the sensor ICF of expressway in Beijing possesses a negative exponent property.The traffic information is more abundant at or near the locations of sensor,while with the distance away from the sensor increasing,the traffic information credibility will be declined by an exponential trend.The new measure provides theoretical bases for the optimal locations of traffic sensor networks and the mechanism research of spatial distribution of traffic information credibility.
