The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studi...The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO4·5H2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.展开更多
文摘The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO4·5H2O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.
