This article is mainly about the prep aration of ultrafine copper-silver bimetallic powders with Direct -Red uction at the existence of macromolecule di spersant in this article￡(r)It also dis cussed the factors of c...This article is mainly about the prep aration of ultrafine copper-silver bimetallic powders with Direct -Red uction at the existence of macromolecule di spersant in this article￡(r)It also dis cussed the factors of controlling granularity which include reaction temperature,concentration of reactant,reaction time,dosage of reducing agent and macromolecule dispersant and so on￡(r)In addition,it studied the properti es of ultrafine copper-silver bimetallic powders including the antioxidatio n￡?antibacterium and conductive pro perties￡(r)It has got satisfying resul ts￡(r)展开更多
The resource comes from waste cupric liquor produced in the process of manufacturing printed circuit board(PCB). In the liquid phase, we get high pureness and excellent property nano Cu with the hydrazine dydrate as t...The resource comes from waste cupric liquor produced in the process of manufacturing printed circuit board(PCB). In the liquid phase, we get high pureness and excellent property nano Cu with the hydrazine dydrate as the reducer and the PVP and OP 10 as the dispersant. After the nano Cu is sensitized and acted, the nano Cu Ag Bimetallic Powders are got through 5% PVP and OP 10 are went into the plating solution and they are chemic plating. It is stated by the experimentation result that the powders can substitute Ag as the padding of conduction coating or shield coating.展开更多
The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion str...The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at展开更多
文摘This article is mainly about the prep aration of ultrafine copper-silver bimetallic powders with Direct -Red uction at the existence of macromolecule di spersant in this article￡(r)It also dis cussed the factors of controlling granularity which include reaction temperature,concentration of reactant,reaction time,dosage of reducing agent and macromolecule dispersant and so on￡(r)In addition,it studied the properti es of ultrafine copper-silver bimetallic powders including the antioxidatio n￡?antibacterium and conductive pro perties￡(r)It has got satisfying resul ts￡(r)
文摘The resource comes from waste cupric liquor produced in the process of manufacturing printed circuit board(PCB). In the liquid phase, we get high pureness and excellent property nano Cu with the hydrazine dydrate as the reducer and the PVP and OP 10 as the dispersant. After the nano Cu is sensitized and acted, the nano Cu Ag Bimetallic Powders are got through 5% PVP and OP 10 are went into the plating solution and they are chemic plating. It is stated by the experimentation result that the powders can substitute Ag as the padding of conduction coating or shield coating.
文摘The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at
