The article improves the process of dielectric barrier discharge(DBD)activated anode bonding.The treated surface was characterized by the hydrophilic surface test.The results showed that the hydrophilic angle was sign...The article improves the process of dielectric barrier discharge(DBD)activated anode bonding.The treated surface was characterized by the hydrophilic surface test.The results showed that the hydrophilic angle was significantly reduced under nano-gap conditions and the optimal discharge voltage was 2 kV.Then,the anodic bonding and dielectric barrier discharge activated bonding were performed in comparison experiments,and the bonding strength was characterized by tensile failure test.The results showed that the bonding strength was higher under the nano-gap dielectric barrier discharge.This process completed 110°C ultra-low temperature anodic bonding and the bonding strength reached 2 MPa.Finally,the mechanism of promoting bonding after activation is also discussed.展开更多
This study investigates the differences in microstructural control between cryogenic forging combined with pre-deformation(PCF)and traditional thermal forging(TTF)for 7050 aluminum forgings intended for aerospace appl...This study investigates the differences in microstructural control between cryogenic forging combined with pre-deformation(PCF)and traditional thermal forging(TTF)for 7050 aluminum forgings intended for aerospace applications.The PCF process,utilizing cryogenic deformation,significantly refines the coarse grains at the surface of the forgings,resulting in a finer and more uniform microstructure,thereby effectively addressing the issue of surface coarse grains associated with traditional methods.The findings indicate that the PCF process can accumulate higher stored energy,facilitating static recrystallization(SRX)during subsequent heat treatment and enhancing the microstructural uniformity.Utilizing various analytical techniques,including optical microscopy(OM),electron backscatter diffraction(EBSD),and transmission electron microscopy(TEM).This study reveals the superiority of the PCF process in terms of strain accumulation,dislocation density,and grain refinement.In conclusion,this method offers advantages in enhancing the performance and microstructural uniformity of 7050 aluminum forgings,presenting new opportunities for applications in the aluminum forging industry.展开更多
基金Project(6140863020216JW30001)supported by the General Armaments Department Pre-research Fund,China。
文摘The article improves the process of dielectric barrier discharge(DBD)activated anode bonding.The treated surface was characterized by the hydrophilic surface test.The results showed that the hydrophilic angle was significantly reduced under nano-gap conditions and the optimal discharge voltage was 2 kV.Then,the anodic bonding and dielectric barrier discharge activated bonding were performed in comparison experiments,and the bonding strength was characterized by tensile failure test.The results showed that the bonding strength was higher under the nano-gap dielectric barrier discharge.This process completed 110°C ultra-low temperature anodic bonding and the bonding strength reached 2 MPa.Finally,the mechanism of promoting bonding after activation is also discussed.
基金Project(2021GK1040) supported by the Major Projects of Scientific and Technology Innovation of Hunan Province,ChinaProjects(52375398,52171018) supported by the National Natural Science Foundation of China+1 种基金Project(Kfkt2023-09) supported by the Open Research Fund of State Key Laboratory of Precision Manufacturing for Extreme Service Performance,Central South University,ChinaProject(E2021203059) supported by the Natural Science Foundation of Hebei Province,China。
文摘This study investigates the differences in microstructural control between cryogenic forging combined with pre-deformation(PCF)and traditional thermal forging(TTF)for 7050 aluminum forgings intended for aerospace applications.The PCF process,utilizing cryogenic deformation,significantly refines the coarse grains at the surface of the forgings,resulting in a finer and more uniform microstructure,thereby effectively addressing the issue of surface coarse grains associated with traditional methods.The findings indicate that the PCF process can accumulate higher stored energy,facilitating static recrystallization(SRX)during subsequent heat treatment and enhancing the microstructural uniformity.Utilizing various analytical techniques,including optical microscopy(OM),electron backscatter diffraction(EBSD),and transmission electron microscopy(TEM).This study reveals the superiority of the PCF process in terms of strain accumulation,dislocation density,and grain refinement.In conclusion,this method offers advantages in enhancing the performance and microstructural uniformity of 7050 aluminum forgings,presenting new opportunities for applications in the aluminum forging industry.
