For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo oh...For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo ohms. A differential paired eFuse cell is designed which is about half the size smaller in sensing resistance of a programmed eFuse link than the conventional single-ended eFuse cell. Also, a sensing circuit of sense amplifier is proposed, based on D flip-flop structure to implement a simple sensing circuit. Furthermore, a sensing margin test circuit is proposed with variable pull-up loads out of consideration for resistance variation of a programmed eFuse. When an 8 bit eFuse OTP IP is designed with 0.18 ~tm standard CMOS logic of TSMC, the layout dimensions are 229.04 μm ×100.15μm. All the chips function successfully when 20 test chips are tested with a program voltage of 4.2 V.展开更多
The resistance arrangements of the flexes connecting with the cathode bus bar in aluminum reduction cells were generalized as three modes. In each mode the universal method to select proper resistivity of the flexes w...The resistance arrangements of the flexes connecting with the cathode bus bar in aluminum reduction cells were generalized as three modes. In each mode the universal method to select proper resistivity of the flexes was induced respectively to insure that the current in local group of flexes was equal. Furthermore, a 350 kA aluminum reduction cell based electric field model was developed by finite element method to evaluate the effect of the method. Suggestions on selection of three modes were also put forward. The results show that the methods of resistance optimization can reduce the current variation about 180 A compared with that in original case.展开更多
Metal organic chemical vapor deposition(MOCVD) is a key equipment in the manufacturing of semiconductor optoelectronic devices and microwave devices in industry. Heating system is a vital part of MOCVD. Specific heati...Metal organic chemical vapor deposition(MOCVD) is a key equipment in the manufacturing of semiconductor optoelectronic devices and microwave devices in industry. Heating system is a vital part of MOCVD. Specific heating device and thermal control technology are needed for each new reactor design. By using resistance-wire heating MOCVD reaction chamber model, thermal analysis and structure optimization of the reactor were developed from the vertical position and the distance between coils of the resistance-wire heater. It is indicated that, within a certain range, the average temperature of the graphite susceptor varies linearly with the vertical distance of heater to susceptor, and with the changed distances between the coils; furthermore, single resistance-wire heater should be placed loosely in the internal and tightly in the external. The modulate accuracy of the temperature field approximately equals the change of the average temperature corresponding to the change of the coil position.展开更多
文摘For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo ohms. A differential paired eFuse cell is designed which is about half the size smaller in sensing resistance of a programmed eFuse link than the conventional single-ended eFuse cell. Also, a sensing circuit of sense amplifier is proposed, based on D flip-flop structure to implement a simple sensing circuit. Furthermore, a sensing margin test circuit is proposed with variable pull-up loads out of consideration for resistance variation of a programmed eFuse. When an 8 bit eFuse OTP IP is designed with 0.18 ~tm standard CMOS logic of TSMC, the layout dimensions are 229.04 μm ×100.15μm. All the chips function successfully when 20 test chips are tested with a program voltage of 4.2 V.
基金Project(60634020) supported by the National Natural Science Foundation of China
文摘The resistance arrangements of the flexes connecting with the cathode bus bar in aluminum reduction cells were generalized as three modes. In each mode the universal method to select proper resistivity of the flexes was induced respectively to insure that the current in local group of flexes was equal. Furthermore, a 350 kA aluminum reduction cell based electric field model was developed by finite element method to evaluate the effect of the method. Suggestions on selection of three modes were also put forward. The results show that the methods of resistance optimization can reduce the current variation about 180 A compared with that in original case.
基金Projects(61376076,61274026,61377024)supported by the National Natural Science Foundation of ChinaProjects(12C0108,13C321)supported by the Scientific Research Fund of Hunan Provincial Education Department,ChinaProjects(2013FJ2011,2013FJ4232)supported by the Science and Technology Plan of Hunan Province,China
文摘Metal organic chemical vapor deposition(MOCVD) is a key equipment in the manufacturing of semiconductor optoelectronic devices and microwave devices in industry. Heating system is a vital part of MOCVD. Specific heating device and thermal control technology are needed for each new reactor design. By using resistance-wire heating MOCVD reaction chamber model, thermal analysis and structure optimization of the reactor were developed from the vertical position and the distance between coils of the resistance-wire heater. It is indicated that, within a certain range, the average temperature of the graphite susceptor varies linearly with the vertical distance of heater to susceptor, and with the changed distances between the coils; furthermore, single resistance-wire heater should be placed loosely in the internal and tightly in the external. The modulate accuracy of the temperature field approximately equals the change of the average temperature corresponding to the change of the coil position.
