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PEG在电子电镀铜中的作用机制及应用
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作者 杨彦章 陈志华 +3 位作者 钟上彪 叶绍明 刘彬云 詹东平 《电镀与精饰》 北大核心 2025年第3期96-105,共10页
电镀铜是电子工业中不可或缺的工艺,广泛应用于印刷电路板、集成电路等电子元件的线路互联制造,铜镀层质量对产品性能和可靠性至关重要。聚乙二醇(PEG)是电镀铜工艺的重要添加剂之一,能改善镀层质量和性能,显著提升电镀产品应用可靠性... 电镀铜是电子工业中不可或缺的工艺,广泛应用于印刷电路板、集成电路等电子元件的线路互联制造,铜镀层质量对产品性能和可靠性至关重要。聚乙二醇(PEG)是电镀铜工艺的重要添加剂之一,能改善镀层质量和性能,显著提升电镀产品应用可靠性。本文综述PEG在电镀铜中的作用机制,包括对铜离子还原、镀液性质和铜晶粒生长的影响,以及对铜镀层性能的多方面改善效应。同时,对比不同类型PEG衍生物和类似物的应用效果,并对未来研究方向进行了展望。 展开更多
关键词 PEG(聚乙二醇) 电镀 作用机制 电镀性能
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Ni-Cr alloy electrodepositing technology on Fe substrate and coating performance 被引量:2
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作者 许利剑 龚竹青 +3 位作者 汤建新 贺全国 何农跃 杜晶晶 《Journal of Central South University of Technology》 EI 2007年第2期181-185,共5页
The Ni-Cr alloy electrodepositing technology on iron substrate in the chlorid-sulfate solution and the impacts of main processing parameters on coating composition were studied. The optimal Ni-Cr alloy electrodepositi... The Ni-Cr alloy electrodepositing technology on iron substrate in the chlorid-sulfate solution and the impacts of main processing parameters on coating composition were studied. The optimal Ni-Cr alloy electrodepositing conditions are that the cathode current density is 16 A/dm^2,the plating solution temperature is 30℃ and the pH value is 2.5. The bright, compact coating gained under the optimal conditions has good cohesion and 24.1% Cr content. The results show that the coating is composed of crystalline, the average grain size is 82 nm and the higher the Cr content of coating, the larger the rigidity, and the higher the corrosion resistance. The rigidity of coating reaches 78.6(HR30T) and the passivation area broadens to 1.4 V when the Cr content of coating is 24.1%. 展开更多
关键词 ELECTRODEPOSITION PLATING Ni-Cr alloy corrosion resistance
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Anode oxidation of HCHO in THPED-containing electroless copper plating solution 被引量:1
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作者 郑雅杰 肖发新 +1 位作者 邹伟红 王勇 《Journal of Central South University of Technology》 EI 2008年第5期669-673,共5页
The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry cur... The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry curves and anodic polarization curves. Three different oxidation peaks occur at the potentials of -0.62 V (Peak 1), -0.40 V (Peak 2) and -0.17 V (Peak 3) in the anode oxidation process of THPED-containing solution. The reaction at Peak 1, a main oxidation reaction, is the irreversible reaction of adsorbed HCHO with hydrogen evolution. The reaction at Peak 2, a secondary oxidation reaction, is the quasi-reversible reaction of adsorbed HCHO without hydrogen evolution. The reaction at Peak 3 is the irreversible oxidation of anode copper. The current density of Peak 1 increases gradually, that of Peak 2 remains constant and that of Peak 3 decreases with the increase of HCHO concentration. The current density of Peak 3 increases with the increase of THPED concentration and the complexation of THPED promotes the dissolution of anode copper. 展开更多
关键词 electroless copper plating anode oxidation THPED HCHO electrochemical mechanism
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