For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo oh...For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo ohms. A differential paired eFuse cell is designed which is about half the size smaller in sensing resistance of a programmed eFuse link than the conventional single-ended eFuse cell. Also, a sensing circuit of sense amplifier is proposed, based on D flip-flop structure to implement a simple sensing circuit. Furthermore, a sensing margin test circuit is proposed with variable pull-up loads out of consideration for resistance variation of a programmed eFuse. When an 8 bit eFuse OTP IP is designed with 0.18 ~tm standard CMOS logic of TSMC, the layout dimensions are 229.04 μm ×100.15μm. All the chips function successfully when 20 test chips are tested with a program voltage of 4.2 V.展开更多
We propose a single-poly MTP （multi-time programmable） cell consisting of one capacitor and two transistors based on MagnaChip＇s BCD process. The area of a unit cell is 37.743 75μm^2. The proposed single-poly MTP ...We propose a single-poly MTP （multi-time programmable） cell consisting of one capacitor and two transistors based on MagnaChip＇s BCD process. The area of a unit cell is 37.743 75μm^2. The proposed single-poly MTP cell is erased and programmed by the FN tunnelling scheme. We design a 256 bit MTP memory for PMICs （power management ICs） using the proposed single-poly MTP cells. For small-area designs, we propose a selection circuit between V10V and VSV, and a WL （word-line） driver by simplifying its logic circuit. We reduce the total layout area by using pumped internal node voltages from a seven-stage cross-coupled charge pump for V10V （=10 V） and V5V （=5 V） without any additional charge pumps. The layout size of the designed 256 bit MTP memory is 618.250 μm × 437.425μm.展开更多
文摘For the conventional single-ended eFuse cell, sensing failures can occur due to a variation of a post-program eFuse resistance during the data retention time and a relatively high program resistance of several kilo ohms. A differential paired eFuse cell is designed which is about half the size smaller in sensing resistance of a programmed eFuse link than the conventional single-ended eFuse cell. Also, a sensing circuit of sense amplifier is proposed, based on D flip-flop structure to implement a simple sensing circuit. Furthermore, a sensing margin test circuit is proposed with variable pull-up loads out of consideration for resistance variation of a programmed eFuse. When an 8 bit eFuse OTP IP is designed with 0.18 ~tm standard CMOS logic of TSMC, the layout dimensions are 229.04 μm ×100.15μm. All the chips function successfully when 20 test chips are tested with a program voltage of 4.2 V.
基金Project supported by the Second Stage of Brain Korea 21 Projectssupported by Industrial Strategic Technology Development Program funded by the Ministry of Knowledge Economy (MKE,Korea)(10039239,"Development of Power Management System SoC Supporting Multi-Battery-Cells and Multi-Energy-Sources for Smart Phones and Smart Devices")
文摘We propose a single-poly MTP （multi-time programmable） cell consisting of one capacitor and two transistors based on MagnaChip＇s BCD process. The area of a unit cell is 37.743 75μm^2. The proposed single-poly MTP cell is erased and programmed by the FN tunnelling scheme. We design a 256 bit MTP memory for PMICs （power management ICs） using the proposed single-poly MTP cells. For small-area designs, we propose a selection circuit between V10V and VSV, and a WL （word-line） driver by simplifying its logic circuit. We reduce the total layout area by using pumped internal node voltages from a seven-stage cross-coupled charge pump for V10V （=10 V） and V5V （=5 V） without any additional charge pumps. The layout size of the designed 256 bit MTP memory is 618.250 μm × 437.425μm.
