基于海洋石油平台系统特征,比较分析了火炬系统的两种热辐射模型,建立了适用于水幕系统的两通量隔热模型.通过实验数据对比,验证了模型的适用性.结果表明,Thornton辐射模型比API RP 521标准中的方法更为合理;雾场特性参数对水幕系统的...基于海洋石油平台系统特征,比较分析了火炬系统的两种热辐射模型,建立了适用于水幕系统的两通量隔热模型.通过实验数据对比,验证了模型的适用性.结果表明,Thornton辐射模型比API RP 521标准中的方法更为合理;雾场特性参数对水幕系统的隔热效果有着很大的影响,水幕透射率随着液滴出口压力的增大而逐渐减小,但影响幅度逐渐减少.基于该模型所得到的实际海洋石油平台的火炬辐射水幕隔热系统的设计证明了该模型具有较好的合理性及较强的工程适用性.展开更多
A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface...A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.展开更多
文摘基于海洋石油平台系统特征,比较分析了火炬系统的两种热辐射模型,建立了适用于水幕系统的两通量隔热模型.通过实验数据对比,验证了模型的适用性.结果表明,Thornton辐射模型比API RP 521标准中的方法更为合理;雾场特性参数对水幕系统的隔热效果有着很大的影响,水幕透射率随着液滴出口压力的增大而逐渐减小,但影响幅度逐渐减少.基于该模型所得到的实际海洋石油平台的火炬辐射水幕隔热系统的设计证明了该模型具有较好的合理性及较强的工程适用性.
基金Project(N110204015)supported by the Fundamental Research Funds for the Central Universities,ChinaProject(2012M510075)supported by the China Postdoctoral Science Foundation
文摘A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.
