HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) ...HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) and BGA(ball grid array) under thermal cycle test,and studies influences of profile parameters of the thermal cycle,such as hot and cold soak temperature,hot and cold soak time and temperature change rate,on elastic strain range,accumulated plastic strain,fatigue life and test efficiency of two types of solder joints.Based on the above research and experimental verification,this paper presents the method to build an optimal thermal cycling profile for HALT of electronic components.展开更多
基金Sponsored by National Advanced Research Project of China (41319030101)
文摘HALT(highly accelerated life test) is a new reliability test technique.This paper uses nonlinear finite element method to analyze the stress strain characteristic of solder joints of PQFP(plastic quad flat packaging) and BGA(ball grid array) under thermal cycle test,and studies influences of profile parameters of the thermal cycle,such as hot and cold soak temperature,hot and cold soak time and temperature change rate,on elastic strain range,accumulated plastic strain,fatigue life and test efficiency of two types of solder joints.Based on the above research and experimental verification,this paper presents the method to build an optimal thermal cycling profile for HALT of electronic components.
