The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallograph...The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.展开更多
用原位自生法制备了 Ti Al- B合金 ,并用 XRD、SEM对材料的相组成、微观组织和初生 Ti B2 晶体的界面结构特征进行了研究。结果表明 :该合金主要由 Ti Al和 Ti B2 两相组成 ;初生 Ti B2 呈六面棱柱状 ,在其 (0 0 0 1)面存在清晰的生长...用原位自生法制备了 Ti Al- B合金 ,并用 XRD、SEM对材料的相组成、微观组织和初生 Ti B2 晶体的界面结构特征进行了研究。结果表明 :该合金主要由 Ti Al和 Ti B2 两相组成 ;初生 Ti B2 呈六面棱柱状 ,在其 (0 0 0 1)面存在清晰的生长台阶、凸台状或柱棒状分枝 ,它们的各晶面取向与母体的取向一致。分析表明 ,在 Ti Al- B合金凝固过程中初生 Ti B2 晶体的固 -液界面是不稳定的 ,使固 -液界面由一完整光滑的界面逐渐演变为由多个相互独立的次级界面构成的复杂界面 ,次级界面亦为小面结构。展开更多
文摘The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.
