载波芯片(chip on carrier,COC)是光发射次模块(transmitter optical subassembly,TOSA)的重要组成部分,被广泛应用于光通信领域,实现光电转换。针对载波芯片崩口、定位柱破损以及波导污渍三种不同类别缺陷的实时检测问题,提出了一种基...载波芯片(chip on carrier,COC)是光发射次模块(transmitter optical subassembly,TOSA)的重要组成部分,被广泛应用于光通信领域,实现光电转换。针对载波芯片崩口、定位柱破损以及波导污渍三种不同类别缺陷的实时检测问题,提出了一种基于轻量级卷积神经网络的载波芯片缺陷检测算法YOLO-Efficientnet。为了减少网络参数,缩短检测时间,采用轻量级卷积神经网络Efficientnet作为主干网络对图像进行特征提取,在移动翻转瓶颈卷积(MBConv)的基础上,引入了压缩与激发网络(SENet)的注意力思想,在通道维度上引入注意力机制;为了解决下采样的过程中导致信息丢失的问题,引入空间金字塔池化(SPP)结构来增大图像的感受野,分离出更加显著的上下文特征。针对COC缺陷多尺度以及波导区域污渍小目标难以检测的问题,引入了PANet结构进行多尺度特征融合。实验结果表明,提出的算法对COC缺陷检测的准确率达到了98.5%,检测时间达到每张图片0.42 s,满足实时检测的需求。展开更多
Thermo-hydraulic calculation and analysis for sub-module of Chinese HCSB TBM were carried out using FE code ANSYS. Results indicate that temperature distribution in materials used in sub-module is reasonable and accep...Thermo-hydraulic calculation and analysis for sub-module of Chinese HCSB TBM were carried out using FE code ANSYS. Results indicate that temperature distribution in materials used in sub-module is reasonable and acceptable.展开更多
文摘Thermo-hydraulic calculation and analysis for sub-module of Chinese HCSB TBM were carried out using FE code ANSYS. Results indicate that temperature distribution in materials used in sub-module is reasonable and acceptable.
