以聚苯乙烯微球的单层和双层胶体晶体为模板,通过模板电沉积银,移除模板后得到单层和双层银通孔阵列,并用作基于增强光透射(EOT)的等离子传感器.结果表明,与单层银通孔阵列相比,双层通孔阵列的传感灵敏度和品质因子都有很大提升,最高分...以聚苯乙烯微球的单层和双层胶体晶体为模板,通过模板电沉积银,移除模板后得到单层和双层银通孔阵列,并用作基于增强光透射(EOT)的等离子传感器.结果表明,与单层银通孔阵列相比,双层通孔阵列的传感灵敏度和品质因子都有很大提升,最高分别达到559.71 nm/RIU(RIU:Refractive index unit)和14.28 RIU^(-1).展开更多
Ni nanoparticles plating was prepared in reverse microemulsion. The deposition was carried out through the Brownian motion of water pools in the reverse microemulsion and the adsorption of water pools on the electrode...Ni nanoparticles plating was prepared in reverse microemulsion. The deposition was carried out through the Brownian motion of water pools in the reverse microemulsion and the adsorption of water pools on the electrode surface. Effects of electrolytic parameters on the size of Ni particles were studied. The performances of hydrogen evolution and hydrogen storage of the Ni nanoparticles plating electrode were also investigated. The results indicate that the size of Ni nanoparticles decreases with the increase of Ni2+ concentration and the decrease of current density. The electrochemical activity of Ni nanoparticles plating electrode is much higher than that of bulk Ni electrode.展开更多
文摘以聚苯乙烯微球的单层和双层胶体晶体为模板,通过模板电沉积银,移除模板后得到单层和双层银通孔阵列,并用作基于增强光透射(EOT)的等离子传感器.结果表明,与单层银通孔阵列相比,双层通孔阵列的传感灵敏度和品质因子都有很大提升,最高分别达到559.71 nm/RIU(RIU:Refractive index unit)和14.28 RIU^(-1).
基金Projects(20673036,J0830415) supported by the National Natural Science Foundation of ChinaProject(09JJ3025) supported by Hunan Provincial Natural Science Foundation of ChinaProject(09GK3173) supported by the Planned Science and Technology Project of Hunan Province,China
文摘Ni nanoparticles plating was prepared in reverse microemulsion. The deposition was carried out through the Brownian motion of water pools in the reverse microemulsion and the adsorption of water pools on the electrode surface. Effects of electrolytic parameters on the size of Ni particles were studied. The performances of hydrogen evolution and hydrogen storage of the Ni nanoparticles plating electrode were also investigated. The results indicate that the size of Ni nanoparticles decreases with the increase of Ni2+ concentration and the decrease of current density. The electrochemical activity of Ni nanoparticles plating electrode is much higher than that of bulk Ni electrode.